Les dernières technologies de I.O. Interconnect | Heisener Electronics
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Les dernières technologies de I.O. Interconnect

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Technology Cover

2024-05-27, Power requirements for medical devices

The growing adoption of advanced medical devices has led to the design and utilization of a diverse range of complex medical equipment, both in hospital settings and for telecare at home.

Technology Cover

2022-07-26, SIKO AP05 IO-Link position indicator – the most compact solution for process-safe format changeovers

SIKO presents the most compact product in this segment - the AP05 with integrated IO-Link interface. Networked position indicators are now indispensable in the machine building industry as a central component for monitoring format changeovers. They show the machine operator the setpoint and actual value on the adjustment spindle, which greatly improves the operator's comfort.

Technology Cover

2022-03-11, Fast and accurate testing of standard oscillators and VCXO and TCXO/VCTCXO

The IOSC EVBoard is available in six smaller sizes that can be snapped off the motherboard and can be welded to quad-pad oscillators of different sizes. The board offers three configurations for output signals, and the evaluation board offers two options - as an unfilled PCB with a proper BOM, and as a filled board for immediate use