The rugged Molex ML-XT sealed connector system is cost-effectively offers superior reliability. The ML-XT system’s plastic housing and seal are moulded using a one-piece design, which is not only economical but also highly-reliable. Permanent bonding using two-shot liquid silicone rubber (LSR) moulding technology ensures IP68 ingress resistance as well as immunity to loss or misalignment of the seal. Accurate alignment ensures repeatable retention during unmating and mating of the plug and receptacle.
The new S12ZVC MagniVT mixed-signal microcontroller from Freescale Semiconductor. The S12ZVC 16 bit MCU is based on a 32MHz S12Z core and has 192 KBytes of Flash memory, 12 KBytes of RAM, 2 KBytes of EPROM, integrates CAN Physical Layer, a 12 bit analog to digital converter (ADC), 8 bit DAC, and more.
To meet increasing demands from the automotive market, Syfer Technology has improved its offering of AEC-Q200 qualified devices. In particular its multilayer ceramic capacitors (MLCC’s) and EMI filter products now have extended ranges.
Harwin is congratulating Warwick University on the successful launch its WUSAT-2 satellite earlier this month. The student-run project, which has now built and launched a small 10cm x 10cm x 10cm CubeSat satellite into space, relies on high-reliability, miniature connectors from Harwin to provide the vital interconnect used in experimental equipment carried by the satellite.
TinyGreenPC has launched a fully-upgradeable and expandable fanless PC offering four times the performance and memory capacity of the previous fanless FitPC2 in a unit 30% smaller. Based on an AMD Quad Core processor, the new ‘fitlet’ offers an unprecedented level of expandability for a pocket-size fanless PC. Memory, storage, network, extension cards and operating system can all easily be installed and upgraded by the user.
Stackpole Electronics has expanded its metal film MELF series, MLF/MLFM, to now include the 0102 size. This size is offered in 1/8W and 1/5W power ratings and is capable of tolerances down to ±0.1% and TCR’s as low as ±15 ppm.
Lattice’s iCE40 UltraLite family of optimum logic, small-footprint, low I/O count ultra low-power FPGAs and sensor managers features instant-on capability. The devices are designed for ultra low-power mobile applications, like smartphones, tablets and hand-held devices. The iCE40 UltraLite family includes integrated blocks to interface with virtually all mobile sensors and application processors.
Altium has released the newest version of its flagship PCB design tool, Altium Designer 15.1. Included in the release are a number of new features to improve design efficiency with expansions to productivity, documentation, and high-speed design.
TDK’s new SDS1B series of 6Gbps serial ATA-compatible 2.5-inch solid-state drives for industrial applications, feature the NAND flash memory controller chip GBDriver GS1.
SchmartBoard BeagleBone prototyping cape kits can be used to add through-hole and surface-mount circuitry to create functional specific add-on capes to BeagleBone or BeagleBone Black projects.
Aimed at teachers, students, electronic design engineers, hobbyists and makers that can benefit from a portable, low-cost source measure unit that works by streaming to a desktop computer or laptop – the Analog devices ADALM1000 active learning module.
The UCC24650 is an easy-to-use secondary-side voltage monitor from Texas Instruments (TI). The device periodically measures its own VDD voltage. A relative drop of 3% from the previous reading triggers an alert signal to a receiving primary-side regulation (PSR) controller. Its low-power consumption helps achieve <5mW standby loss in many applications.
The Analog Devices AD9154-EBZ, AD9154-M6720-EBZ and AD9154-FMC-EBZ which support the AD9154 – a quad, 16-bit, high dynamic range digital-to-analog converter (DAC) that provides a maximum sample rate of 2.4 GSPS, permitting multicarrier generation up to the Nyquist frequency in baseband mode.
Versarien low-profile metallic foam heat sinks are Offering high thermal performance for low-profile applications. The heat sinks use VersarienCu micro-porous metallic copper foam. The interconnected pores of the foam create a large surface area. The surface area combined with the high thermal conductivity of copper allow for the height of the heat sinks to be reduced without sacrificing performance.
In applications that require highly accurate clocks, there are several alternatives for meeting the combination of frequency accuracy, ultra-low phase jitter and high fan-out. By Juan Conchas, Marketing Director, Micrel.
Aimed at applications such as solar inverters, UPS systems, motor drives, high-voltage DC-DC converters and switch-mode power supplies - STMicroelectronics SCTx0N120 silicon carbide power MOSFETs.
The AP7344 from Diodes Incorporated is a new dual 300mA low-dropout (LDO) regulator that offers high 1% output accuracy and a low quiescent current of 50μA. The device features a small package to suit battery-powered consumer products such as cameras, smart phones and tablets.
Amphenol’s high-density HDB³ and HSB³ Series aerospace connector. The high-performance interconnects incorporate a higher density contact pattern and lower mated height than the company’s standard low mating force rectangular brush connectors.
