Produits Maxim Integrated - TVS - Technologies mixtes | Heisener Electronics
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Produits Maxim Integrated - TVS - Technologies mixtes

Dossiers 38
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Fabricant
Description
paquet
Stock
Quantité
Technology
Number of Circuits
Number of Circuits
Applications
Mounting Type
Package / Case
Supplier Device Package
MAX6397WATA+T
Maxim Integrated

IC SW OVERVOLT PROT 8-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-WDFN Exposed Pad
  • Supplier Device Package: 8-TDFN-EP (3x3)
paquet: 8-WDFN Exposed Pad
Stock5 094
Mixed Technology
1
1
General Purpose
Surface Mount
8-WDFN Exposed Pad
8-TDFN-EP (3x3)
MAX6397YATA+T
Maxim Integrated

IC SW OVERVOLT PROT 8-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-WDFN Exposed Pad
  • Supplier Device Package: 8-TDFN-EP (3x3)
paquet: 8-WDFN Exposed Pad
Stock7 560
Mixed Technology
1
1
General Purpose
Surface Mount
8-WDFN Exposed Pad
8-TDFN-EP (3x3)
MAX6397ZATA+T
Maxim Integrated

IC SW OVERVOLT PROT 8-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-WDFN Exposed Pad
  • Supplier Device Package: 8-TDFN-EP (3x3)
paquet: 8-WDFN Exposed Pad
Stock7 128
Mixed Technology
1
1
General Purpose
Surface Mount
8-WDFN Exposed Pad
8-TDFN-EP (3x3)
hot MAX367EWN
Maxim Integrated

IC CIRCUIT PROTECTR 1LINE 18SOIC

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 8
  • Number of Circuits: 8
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 18-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 18-SOIC
paquet: 18-SOIC (0.295", 7.50mm Width)
Stock8 820
Mixed Technology
8
8
General Purpose
Surface Mount
18-SOIC (0.295", 7.50mm Width)
18-SOIC
MAX367EPN
Maxim Integrated

IC CIRCUIT PROTECTR 1LINE 18-DIP

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 8
  • Number of Circuits: 8
  • Applications: General Purpose
  • Mounting Type: Through Hole
  • Package / Case: 18-DIP (0.300", 7.62mm)
  • Supplier Device Package: 18-PDIP
paquet: 18-DIP (0.300", 7.62mm)
Stock6 192
Mixed Technology
8
8
General Purpose
Through Hole
18-DIP (0.300", 7.62mm)
18-PDIP
hot MAX367CWN
Maxim Integrated

IC SIGNAL-LINE CIRC PROT 18-SOIC

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 8
  • Number of Circuits: 8
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 18-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 18-SOIC
paquet: 18-SOIC (0.295", 7.50mm Width)
Stock11 808
Mixed Technology
8
8
General Purpose
Surface Mount
18-SOIC (0.295", 7.50mm Width)
18-SOIC
hot MAX367CPN
Maxim Integrated

IC CIRCUIT PROT SIGNALLINE 18DIP

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 8
  • Number of Circuits: 8
  • Applications: General Purpose
  • Mounting Type: Through Hole
  • Package / Case: 18-DIP (0.300", 7.62mm)
  • Supplier Device Package: 18-PDIP
paquet: 18-DIP (0.300", 7.62mm)
Stock5 256
Mixed Technology
8
8
General Purpose
Through Hole
18-DIP (0.300", 7.62mm)
18-PDIP
MAX366CSA
Maxim Integrated

IC SIGNAL-LINE CIRC PROT 8-SOIC

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 3
  • Number of Circuits: 3
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock3 384
Mixed Technology
3
3
General Purpose
Surface Mount
8-SOIC (0.154", 3.90mm Width)
8-SOIC
hot MAX366CPA
Maxim Integrated

IC CIRCUIT PROT SIGNAL-LINE 8DIP

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 3
  • Number of Circuits: 3
  • Applications: General Purpose
  • Mounting Type: Through Hole
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock8 100
Mixed Technology
3
3
General Purpose
Through Hole
8-DIP (0.300", 7.62mm)
8-PDIP
MAX6497ATA+T
Maxim Integrated

IC CNTRLR PROT SW 8-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-WDFN Exposed Pad
  • Supplier Device Package: 8-TDFN-EP (3x3)
paquet: 8-WDFN Exposed Pad
Stock3 042
Mixed Technology
1
1
General Purpose
Surface Mount
8-WDFN Exposed Pad
8-TDFN-EP (3x3)
MAX6498ATA+T
Maxim Integrated

IC CNTRLR PROT SW 8-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-WDFN Exposed Pad
  • Supplier Device Package: 8-TDFN-EP (3x3)
paquet: 8-WDFN Exposed Pad
Stock7 398
Mixed Technology
1
1
General Purpose
Surface Mount
8-WDFN Exposed Pad
8-TDFN-EP (3x3)
MAX367EWN+T
Maxim Integrated

IC CIRCUIT PROTECTR 1LINE 18SOIC

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 8
  • Number of Circuits: 8
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 18-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 18-SOIC
paquet: 18-SOIC (0.295", 7.50mm Width)
Stock5 022
Mixed Technology
8
8
General Purpose
Surface Mount
18-SOIC (0.295", 7.50mm Width)
18-SOIC
hot MAX366ESA+T
Maxim Integrated

IC CIRC PROT SIGNAL-LINE 8-SOIC

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 3
  • Number of Circuits: 3
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock6 750
Mixed Technology
3
3
General Purpose
Surface Mount
8-SOIC (0.154", 3.90mm Width)
8-SOIC
hot MAX6397SATA+T
Maxim Integrated

IC SW OVERVOLT PROT 8-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-WDFN Exposed Pad
  • Supplier Device Package: 8-TDFN-EP (3x3)
paquet: 8-WDFN Exposed Pad
Stock60 000
Mixed Technology
1
1
General Purpose
Surface Mount
8-WDFN Exposed Pad
8-TDFN-EP (3x3)
MAX6397TATA+T
Maxim Integrated

IC SW OVERVOLT PROT 8-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-WDFN Exposed Pad
  • Supplier Device Package: 8-TDFN-EP (3x3)
paquet: 8-WDFN Exposed Pad
Stock4 464
Mixed Technology
1
1
General Purpose
Surface Mount
8-WDFN Exposed Pad
8-TDFN-EP (3x3)
hot MAX6399ATA+T
Maxim Integrated

IC SW OVERVOLT PROT 8-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-WDFN Exposed Pad
  • Supplier Device Package: 8-TDFN-EP (3x3)
paquet: 8-WDFN Exposed Pad
Stock6 336
Mixed Technology
1
1
General Purpose
Surface Mount
8-WDFN Exposed Pad
8-TDFN-EP (3x3)
MAX367EPN+
Maxim Integrated

IC CIRC PROT SIGNAL-LINE 18-DIP

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 8
  • Number of Circuits: 8
  • Applications: General Purpose
  • Mounting Type: Through Hole
  • Package / Case: 18-DIP (0.300", 7.62mm)
  • Supplier Device Package: 18-PDIP
paquet: 18-DIP (0.300", 7.62mm)
Stock5 490
Mixed Technology
8
8
General Purpose
Through Hole
18-DIP (0.300", 7.62mm)
18-PDIP
MAX367CPN+
Maxim Integrated

IC CIRC PROT SIGNAL-LINE 18-DIP

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 8
  • Number of Circuits: 8
  • Applications: General Purpose
  • Mounting Type: Through Hole
  • Package / Case: 18-DIP (0.300", 7.62mm)
  • Supplier Device Package: 18-PDIP
paquet: 18-DIP (0.300", 7.62mm)
Stock5 094
Mixed Technology
8
8
General Purpose
Through Hole
18-DIP (0.300", 7.62mm)
18-PDIP
hot MAX366CPA+
Maxim Integrated

IC CIRCUIT PROT SIGNAL-LINE 8DIP

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 3
  • Number of Circuits: 3
  • Applications: General Purpose
  • Mounting Type: Through Hole
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock18 000
Mixed Technology
3
3
General Purpose
Through Hole
8-DIP (0.300", 7.62mm)
8-PDIP
hot MAX366EPA+
Maxim Integrated

IC CIRCUIT PROT SIGNAL-LINE 8DIP

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 3
  • Number of Circuits: 3
  • Applications: General Purpose
  • Mounting Type: Through Hole
  • Package / Case: 8-DIP (0.300", 7.62mm)
  • Supplier Device Package: 8-PDIP
paquet: 8-DIP (0.300", 7.62mm)
Stock27 000
Mixed Technology
3
3
General Purpose
Through Hole
8-DIP (0.300", 7.62mm)
8-PDIP
hot MAX6499ATA+T
Maxim Integrated

IC CNTRLR PROT SW 8-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-WDFN Exposed Pad
  • Supplier Device Package: 8-TDFN-EP (3x3)
paquet: 8-WDFN Exposed Pad
Stock98 508
Mixed Technology
1
1
General Purpose
Surface Mount
8-WDFN Exposed Pad
8-TDFN-EP (3x3)
hot MAX6398ATT+T
Maxim Integrated

IC SW OVERVOLT PROT 6-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 6-WDFN Exposed Pad
  • Supplier Device Package: 6-TDFN Exposed Pad (3x3)
paquet: 6-WDFN Exposed Pad
Stock5 292
Mixed Technology
1
1
General Purpose
Surface Mount
6-WDFN Exposed Pad
6-TDFN Exposed Pad (3x3)
hot MAX6397LATA+T
Maxim Integrated

IC SW OVERVOLT PROT 8-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-WDFN Exposed Pad
  • Supplier Device Package: 8-TDFN-EP (3x3)
paquet: 8-WDFN Exposed Pad
Stock14 928
Mixed Technology
1
1
General Purpose
Surface Mount
8-WDFN Exposed Pad
8-TDFN-EP (3x3)
hot MAX4895EETE+T
Maxim Integrated

IC PORT PROTECTOR VGA 16TQFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: VGA Port Protector
  • Mounting Type: Surface Mount
  • Package / Case: 16-WFQFN Exposed Pad
  • Supplier Device Package: 16-TQFN (3x3)
paquet: 16-WFQFN Exposed Pad
Stock9 792
Mixed Technology
1
1
VGA Port Protector
Surface Mount
16-WFQFN Exposed Pad
16-TQFN (3x3)
hot MAX367CWN+
Maxim Integrated

IC SIGNAL-LINE CIRC PROT 18-SOIC

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 8
  • Number of Circuits: 8
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 18-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 18-SOIC
paquet: 18-SOIC (0.295", 7.50mm Width)
Stock2 000
Mixed Technology
8
8
General Purpose
Surface Mount
18-SOIC (0.295", 7.50mm Width)
18-SOIC
MAX366CSA+
Maxim Integrated

IC CIRC PROT SIGNAL-LINE 8-SOIC

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 3
  • Number of Circuits: 3
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock7 440
Mixed Technology
3
3
General Purpose
Surface Mount
8-SOIC (0.154", 3.90mm Width)
8-SOIC
hot MAX6496ATA+T
Maxim Integrated

IC CNTRLR PROT SW 8-TDFN

  • Voltage - Clamping: -
  • Technology: Mixed Technology
  • Number of Circuits: 1
  • Number of Circuits: 1
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-WDFN Exposed Pad
  • Supplier Device Package: 8-TDFN-EP (3x3)
paquet: 8-WDFN Exposed Pad
Stock39 972
Mixed Technology
1
1
General Purpose
Surface Mount
8-WDFN Exposed Pad
8-TDFN-EP (3x3)
hot MAX366ESA+
Maxim Integrated

IC CIRC PROT SIGNAL-LINE 8-SOIC

  • Voltage - Clamping: ±40V
  • Technology: Mixed Technology
  • Number of Circuits: 3
  • Number of Circuits: 3
  • Applications: General Purpose
  • Mounting Type: Surface Mount
  • Package / Case: 8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 8-SOIC
paquet: 8-SOIC (0.154", 3.90mm Width)
Stock12 900
Mixed Technology
3
3
General Purpose
Surface Mount
8-SOIC (0.154", 3.90mm Width)
8-SOIC