Page 2 - Produits Molex, LLC - Supports pour CI, transistors | Heisener Electronics
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Produits Molex, LLC - Supports pour CI, transistors

Dossiers 33
Page  2/2
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
0475962032
Molex, LLC

CONN SOCKET LGA 1155POS

  • Type: LGA
  • Number of Positions or Pins (Grid): -
  • Pitch - Mating: -
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: -
  • Mounting Type: -
  • Features: -
  • Termination: -
  • Pitch - Post: -
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: -
  • Operating Temperature: -
paquet: -
Stock6 192
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0475960532
Molex, LLC

CONN SOCKET LGA 1156POS GOLD

  • Type: LGA
  • Number of Positions or Pins (Grid): 1156 (40 x 40)
  • Pitch - Mating: 0.036" (0.91mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 15µin (0.38µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Closed Frame
  • Termination: Solder
  • Pitch - Post: 0.036" (0.91mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Thermoplastic
  • Operating Temperature: -
paquet: -
Stock2 682
1156 (40 x 40)
0.036" (0.91mm)
Gold
15µin (0.38µm)
Copper Alloy
Surface Mount
Closed Frame
Solder
0.036" (0.91mm)
-
-
-
Thermoplastic
-
0475960233
Molex, LLC

CONN SOCKET LGA 1155POS GOLD

  • Type: LGA
  • Number of Positions or Pins (Grid): 1155 (40 x 40)
  • Pitch - Mating: 0.036" (0.91mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30µin (0.76µm)
  • Contact Material - Mating: Copper Alloy
  • Mounting Type: Surface Mount
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.036" (0.91mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: -
  • Housing Material: Thermoplastic
  • Operating Temperature: -
paquet: -
Stock7 452
1155 (40 x 40)
0.036" (0.91mm)
Gold
30µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.036" (0.91mm)
-
-
-
Thermoplastic
-