Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Multiplexer/Demultiplexer Circuit | Switch Circuit | Number of Channels | On-State Resistance (Max) | Voltage - Supply, Single (V+) | Voltage - Supply, Dual (V±) | -3db Bandwidth | Features | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Solutions Sdn Bhd. |
IC CROSSPOINT SW 40X40 484-FCBGA
|
paquet: 484-BBGA, FCBGA |
Stock2 288 |
|
40:40 | - | 1 | - | 2.5V | - | - | - | - | 484-BBGA, FCBGA | 484-FCBGA (23x23) |
||
Maxim Integrated |
IC VIDEO CROSSPOINT SWITCH LQFP
|
paquet: 128-LQFP |
Stock5 280 |
|
32:16 | - | 1 | - | 4.5 V ~ 5.5 V | ±3 V ~ 5 V | 70MHz | Buffered, SPI | -40°C ~ 85°C (TA) | 128-LQFP | 128-LQFP (14x20) |
||
Lattice Semiconductor Corporation |
IC ISP CROSSPOINT 240IO 388FBGA
|
paquet: 388-BBGA |
Stock7 440 |
|
240:240 | - | 1 | - | 3 V ~ 3.6 V | - | - | - | -40°C ~ 85°C (TA) | 388-BBGA | 388-FPBGA (23x23) |
||
Rohm Semiconductor |
IC VIDEO SIGNAL SWITCHER SOP
|
paquet: 8-SOIC (0.173", 4.40mm Width) |
Stock19 404 |
|
3:1 | - | 1 | - | 4.5 V ~ 13 V | - | - | - | -25°C ~ 75°C (TA) | 8-SOIC (0.173", 4.40mm Width) | 8-SOP |
||
Maxim Integrated |
IC SW BIDIRECT RF VIDEO 16-DIP
|
paquet: 16-DIP (0.300", 7.62mm) |
Stock3 712 |
|
2:1 | SPDT | 2 | 20 Ohm | 2.7 V ~ 12 V | ±2.7 V ~ 6 V | 300MHz | Bi-Directional, Break-Before-Make, T-Switch Configuration | -40°C ~ 85°C (TA) | 16-DIP (0.300", 7.62mm) | 16-PDIP |
||
Analog Devices Inc. |
IC MULTIPLEXER 1 X 2:1 24QFN
|
paquet: 24-TFCQFN Exposed Pad |
Stock4 752 |
|
2:1 | - | 1 | - | 3 V ~ 3.6 V | - | 14GHz | Programmable Output | -40°C ~ 85°C (TA) | 24-TFCQFN Exposed Pad | 24-CSMT (4x4) |
||
Analog Devices Inc. |
IC MULTIPLEXER 1 X 2:1 24QFN
|
paquet: 24-TFCQFN Exposed Pad |
Stock2 544 |
|
2:1 | - | 1 | - | 3 V ~ 3.6 V | - | 14GHz | Programmable Output | -40°C ~ 85°C (TA) | 24-TFCQFN Exposed Pad | 24-CSMT (4x4) |
||
Microchip Technology |
IC 16CH ANALOG SWITCH
|
paquet: Die |
Stock2 368 |
|
1:1 | SPST | 16 | 38 Ohm | 40 V ~ 200 V | ±40 V ~ 160 V | 50MHz | - | 0°C ~ 70°C (TA) | Die | Die |
||
Microsemi Corporation |
IC ANLG SWITCH ARRAY 8X12 40DIP
|
paquet: 40-DIP (0.600", 15.24mm) |
Stock6 928 |
|
8:12 | - | 1 | 65 Ohm | 4.5 V ~ 13.2 V | ±4.5 V | 45MHz | - | -40°C ~ 85°C (TA) | 40-DIP (0.600", 15.24mm) | 40-PDIP |
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Maxim Integrated |
IC VIDEO MULTIPLEXER 4X1 18SOIC
|
paquet: 18-SOIC (0.295", 7.50mm Width) |
Stock5 744 |
|
4:1 | - | 2 | 250 Ohm | 9 V ~ 36 V | ±4.5 V ~ 18 V | - | Break-Before-Make | 0°C ~ 70°C (TA) | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC W |
||
Diodes Incorporated |
IC USB 3.0 MUX/DEMUX SW 42TQFN
|
paquet: 42-VFQFN Exposed Pad |
Stock4 640 |
|
2:1 | - | 2 | - | 3 V ~ 3.6 V | - | 8.2GHz | Bi-Directional, USB 3.0 | - | 42-VFQFN Exposed Pad | 42-TQFN (9x3.5) |
||
Maxim Integrated |
IC MULTIPLEXER 8X1 24TQFN
|
paquet: 24-WFQFN Exposed Pad |
Stock7 472 |
|
8:1 | - | 1 | 24 Ohm | 2.3 V ~ 5.5 V | - | - | Bi-Directional | -40°C ~ 85°C (TA) | 24-WFQFN Exposed Pad | 24-TQFN (4x4) |
||
Diodes Incorporated |
IC DEMULTIPLEXER 4LANE 42TQFN
|
paquet: 42-VFQFN Exposed Pad |
Stock182 328 |
|
2:1 | - | 1 | 10 Ohm | 3.3V | - | 3.25GHz | - | -40°C ~ 85°C (TA) | 42-VFQFN Exposed Pad | 42-TQFN (9x3.5) |
||
Maxim Integrated |
IC AUDIO/VIDEO SWITCH 28QSOP
|
paquet: 28-SSOP (0.154", 3.90mm Width) |
Stock6 528 |
|
2:1, 1:2 | SPST, SPDT | 11 | 35 Ohm | 2.7 V ~ 5.25 V | - | 150MHz | Break-Before-Make, Clickless, I2C | 0°C ~ 70°C (TA) | 28-SSOP (0.154", 3.90mm Width) | 28-QSOP |
||
Broadcom Limited |
PEX8614-BA50BC G
|
paquet: - |
Stock5 280 |
|
- | - | - | - | - | - | - | Configurable | - | - | - |
||
Texas Instruments |
IC ETHERNET SWITCH 16X8 56WQFN
|
paquet: 56-WFQFN Exposed Pad |
Stock345 672 |
|
2:1 | SPDT | 11 | 6 Ohm | 3 V ~ 3.6 V | - | 1.1GHz | 10/100,1000 Base-T, LVDS, LVPECL | -40°C ~ 85°C (TA) | 56-WFQFN Exposed Pad | 56-WQFN-EP (5x11) |
||
NXP |
IC SWITCH DDR2 DDR3 2X1 48TFBGA
|
paquet: 48-TFBGA |
Stock7 632 |
|
2:1 | - | 1 | 10 Ohm (Typ) | 1.4 V ~ 2 V | - | 2.5GHz | Bi-Directional | -10°C ~ 85°C (TA) | 48-TFBGA | 48-TFBGA |
||
Texas Instruments |
IC USB SWITCH SP2T 16UQFN
|
paquet: 16-UFQFN |
Stock5 280 |
|
- | SPDT | 2 | 15 Ohm | 1.65 V ~ 3.6 V | - | 920MHz | I2C, USB 2.0 | -40°C ~ 85°C (TA) | 16-UFQFN | 16-UQFN (2.6x1.8) |
||
Fairchild/ON Semiconductor |
IC USB MUX/SWITCH 16MLP
|
paquet: 16-WFQFN Exposed Pad |
Stock3 952 |
|
4:1 | - | 1 | 9 Ohm | 2.5 V ~ 4.4 V | - | - | Break-Before-Make, USB 2.0 | -40°C ~ 85°C (TA) | 16-WFQFN Exposed Pad | 16-MLP (3x3) |
||
Fairchild/ON Semiconductor |
IC ISOLATION SWITCH 4PST 12WLCSP
|
paquet: 12-UFBGA, WLCSP |
Stock7 632 |
|
- | 4PST | 1 | 800 mOhm (Typ) | 1.6 V ~ 3 V | - | 50MHz | - | -40°C ~ 85°C (TA) | 12-UFBGA, WLCSP | 12-WLCSP (1.16x1.56) |
||
Fairchild/ON Semiconductor |
IC SWITCH DUAL DPDT 12UMLP
|
paquet: 12-UFQFN |
Stock5 712 |
|
2:2 | DPDT | 1 | 1 Ohm | 2.5 V ~ 5.5 V | - | 230MHz | Break-Before-Make | -40°C ~ 85°C (TA) | 12-UFQFN | 12-UMLP (1.8x1.8) |
||
Diodes Incorporated |
IC USB SWITCH HS 10TQFN
|
paquet: 10-WFQFN |
Stock52 728 |
|
2:1 | - | 1 | 3 Ohm (Typ) | 2.7 V ~ 4.4 V | - | - | Bi-Directional, USB 2.0 | - | 10-WFQFN | 10-TQFN (1.3x1.6) |
||
Maxim Integrated |
INTEGRATED CIRCUIT
|
paquet: - |
Stock5 904 |
|
- | - | - | - | - | - | - | - | - | - | - |
||
Renesas Electronics America |
IC USB SWITCH DPST OVP 8TQFN
|
paquet: 8-XFQFN |
Stock4 016 |
|
2:1 | DPST | 1 | 17 Ohm | 2.7 V ~ 5.25 V | - | 790MHz | USB 2.0 | -40°C ~ 85°C (TA) | 8-XFQFN | 8-UTQFN (1.2x1.4) |
||
ON Semiconductor |
IC USB SWITCH DPDT 10MICROPAK
|
paquet: 10-UFQFN Exposed Pad |
Stock5 792 |
|
- | DPDT | 1 | 6.5 Ohm | 3 V ~ 4.3 V | - | 720MHz | Break-Before-Make, USB 2.0 | -40°C ~ 85°C (TA) | 10-UFQFN Exposed Pad | 10-MicroPak™ |
||
Renesas Electronics America |
IC MULTIPLEXER DUAL 2X1 10UFQFN
|
paquet: 10-UFQFN |
Stock4 960 |
|
2:1 | SPDT | 2 | 8 Ohm | 1.8 V ~ 3.3 V | - | 780MHz | Break-Before-Make, USB 2.0 | -40°C ~ 85°C (TA) | 10-UFQFN | 10-UTQFN (2.1x1.6) |
||
Renesas Electronics America |
IC MUX STEREO 2:1 CD/MP3 16-TQFN
|
paquet: 16-WFQFN Exposed Pad |
Stock20 538 |
|
2:1 | SPDT | 2 | 1.9 Ohm | 3.3V, 5V | - | 230MHz | Break-Before-Make, Depop | -40°C ~ 85°C (TA) | 16-WFQFN Exposed Pad | 16-TQFN (3x3) |
||
ON Semiconductor |
IC USB SWITCH DUAL 1X1 14TSSOP
|
paquet: 14-TSSOP (0.173", 4.40mm Width) |
Stock111 132 |
|
2:1 | SPDT | 2 | 1.5 Ohm | 1.65 V ~ 5.5 V | - | 350MHz | Break-Before-Make, USB 1.1 | -40°C ~ 85°C (TA) | 14-TSSOP (0.173", 4.40mm Width) | 14-TSSOP |
||
ON Semiconductor |
IC SWITCH MULTIMEDIA 10-UMLP
|
paquet: 10-WFDFN Exposed Pad |
Stock254 316 |
|
- | DPDT | 1 | 2.7 Ohm (Audio), 11 Ohm (USB) | 1.8 V ~ 4.3 V | - | 720MHz | USB 2.0 | -40°C ~ 85°C (TA) | 10-WFDFN Exposed Pad | 10-MLP (3x3) |
||
ON Semiconductor |
IC USB SWITCH DPDT 10MSOP
|
paquet: 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) |
Stock11 808 |
|
- | DPDT | 1 | 6.5 Ohm | 2.4 V ~ 4.4 V | - | 720MHz | Break-Before-Make, USB 2.0 | -40°C ~ 85°C (TA) | 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) | 10-MSOP |