Silicon Labs announces the new BGM240P and MGM240P PCB modules. The modules are designed to provide faster time-to-market for connected products for smart home and industrial applications; at the same time, as extensions of the BG24 and MG24 series of wireless SoCs, these new modules enable developers to achieve reliable wireless performance, power consumption efficiency and protect devices from cyberattacks.
The new BGM240P and MGM240P PCB modules are designed to provide industry-leading RF performance, low power consumption and broad regulatory approvals so developers can bring devices to market faster. Designed for developers without extensive RF experience, these certified modules offer many of the same benefits as their SoC counterparts, including a Cortex M33 processor with 1.5 MB of flash and 256 kB of RAM, and PSA Level 3 security certification.
With proven RF performance, the new BGM240P and MGM240P modules have passed demanding wireless regulatory certifications such as FCC, CE, IC/ISED, MIC/TELEC and KCC, so designers can simplify complex RF design and testing to Achieve fast time-to-market for products. These modules enable designers to avoid lengthy development and certification cycles and provide support for multiple 2.4 GHz wireless IoT protocols, including Bluetooth Low Energy and Bluetooth Mesh as well as Zigbee, OpenThread, Matter and Multiprotocol.
Security is a core function of these PCB modules, which include PSA Level 3 certified Secure VaultTM, and provide a dedicated security engine with advanced security features, including advanced, DPA countermeasures hardware encryption for security algorithms such as AES128/256, Secure Boot with Root of Trust and Secure Loader (RTSL) technology, tamper detection, and secure key management with Physically Unclonable Function (PUF) and True Random Number Generator (TRNG).
Silicon Labs also offers Wireless Pro Kits with corresponding RF boards to help designers quickly start developing applications using the BGM240P and MGM240P PCB modules. they have a small form factor of only 12.9 mm x 15.0 mm. Its operating range is 1.8 V to 3.8 V, -40°C to +105°CThe kit provides all the necessary development tools for developing wireless applications such as smart home devices, smart lighting, gateways and digital assistants, as well as building automation and security.
