STMicroelectronics LSM6DSV16BX Motion/Bone Conduction two-in-one sensor. The LSM6DSV16BX sensor combines a three-axis digital accelerometer with a three-axis digital gyroscope to provide advanced capabilities for applications such as wearable and audible devices, motion tracking and gesture detection, Internet of Things (IoT) and connectivity devices, and bone conduction for vibration detection.
The STMicroelectronics LSM6DSV16BX Motion/Bone Conduction two-in-one sensor integrates the audio accelerometer, Qvar sensor, and UI sensor in a compact package. The device's outstanding performance and compact dimensions make it ideal for small devices such as headphones and earplugs.
The LSM6DSV16BX sensor uses a three-core architecture to process acceleration, angular rate, and Qvar sensing data on three separate channels. This "normally open" sensor features a low power consumption of only 0.95mA and a high performance mode that ensures uninterrupted operation of the accelerometer and gyroscope.
STMicroelectronics' LSM6DSV16BX Motion/bone Conduction two-in-one sensor is supported by the STEVAL-MKI234KA evaluation kit. The kit is used in conjunction with the STEVAL-MKI109V3 motherboard to provide a demonstration platform for the sensor. In addition, the evaluation suite supports downloadable graphical user interfaces and examples of specialized software for custom applications.
