SECORA™ Pay portfolio with 28nm chip technology | Heisener Electronics
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SECORA™ Pay portfolio with 28nm chip technology

Technology Cover
Date de Parution: 2023-05-10, Infineon Technologies

Infineon Technologies extends the technology process of the SECORA™ Pay solution portfolio to 28nm. Innovative product design enables Infineon to further break the limits of payment card technology. In doing so, the product also provides the latest technology in a reliable sourcing option for payment ecosystems in major regional markets. The new product family is the first of its kind in the market to apply the leading 28 nm chip technology to embedded nonvolatile memory. It aims to ease the semiconductor shortage the payments industry is facing at mature technology nodes.

         

The new line of products uses a safety controller and integrates certified software into a coil module (CoM) chip. The product line also features standardized inlays for easy and rapid card production and compatibility with SECORA Pay products in 65 nm, 40 nm and 28 nm technical specifications, which are available for both existing and new generation SECORA Pay products. And the inductively coupled technology and copper wire card antenna integrated in CoM system, so that engineers can be extremely flexible to design payment cards. As a result, the system is well suited to future market trends, such as eco-friendly payment cards made from recycled materials and Marine plastic or wood, as well as high-performance dual-interface metal or LED payment cards.

Tolgahan Yildiz, head of the Payment Solutions product line at Infineon Technologies' Secure Connected Systems Business Unit, said: "In recent years, the use of dual-interface payment cards for contactless payments has become the global standard due to the impact of COVID-19. "The SECORA Pay solution is designed to enable the manufacture and distribution of high-quality dual-interface payment cards, providing extremely high transaction performance and reliable security for seamless, trusted payments." The global dual-interface payment card market is expected to grow at a compound annual growth rate of 6% from an estimated 2.6 billion starting in 2022 to 2027.

     

Infineon's new plug and play solution provides payment card manufacturers with an easy way to direct and migrate new customers. They are backward compatible with existing SECORA Pay products in terms of business card printing, antenna design, personalization and product certification. In addition, these devices offer excellent contactless and personalized performance, enabling contactless transactions to be completed in 155 milliseconds.

In addition, the SECORA Pay solution enables stable, high-volume dual-interface payment cards to be manufactured with very few resources. This makes contactless payment technology itself resource-efficient. The new value-added service builds on SECORA Pay's NFC tagging capabilities to support more scenarios, such as initial card activation and authentication for online banking and loyalty programs.

          

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