Polymer tantalum chip capacitors increase package density and enable thinner end product designs | Heisener Electronics
Contactez nous
SalesDept@heisener.com +86-755-83210559-834
Language Translation

* Please refer to the English Version as our Official Version.

Polymer tantalum chip capacitors increase package density and enable thinner end product designs

Technology Cover
Date de Parution: 2019-05-26, Vishay BC Components
Vishay Intertechnology, Inc. has expanded its T55 series of vPolyTan surface mount polymer tantalum molded chip capacitors with new devices in a Z-case (EIA 7343-19) size. Vishay Polytech capacitors are 0.1mm lower than standard V-cased devices, increasing package density and allowing design of thinner end products. These devices are optimized for power management, battery decoupling, and energy storage in servers, computers, network infrastructure equipment, solid state drives, and wireless transceivers. This series is available in compact J, P, A, B, T (thin B��maximum 1.2mm), D, V, and Z case sizes, with a wide range of 3.3��F to 680��F in a rated voltage range of 2.5 to 2.5V. Capacitance range. V to 63V with capacitance tolerance of �� 20%. These capacitors have a polymer cathode, so they can provide ultra-low ESR from 500mOhm to 7mOhm at + 25 �� C, which greatly improves performance compared to manganese dioxide devices. Capacitor values ??of up to 1000��F and ESR values ??of a minimum of 6mOhm are being developed. These capacitors operate over a temperature range of -55C to + 105C, provide excellent ripple current ratings up to 5.66A IRMS, and have low internal resistance for enhanced charging and discharging characteristics. This series has lead-free (Pb) terminations, is RoHS-compliant, halogen-free, and Vishay Green. The device is compatible with high-capacity automatic pick-and-place equipment and offers a moisture sensitivity (MSL) of 3.

Produits Connexes