Murata and NXP Semiconductors have collaborated to develop the Type 1XL extremely high-performance Wi-Fi 6 and Bluetooth 5.3 modules using their respective proprietary packaging and miniaturization technologies. The company continues to lead the way in delivering high quality, low power, small form factor communication modules at the lowest cost to help bring IoT to the mass market.
Akira Sasaki, manager of Murata's IoT Module Division, said: "With the advent of more streaming content such as 4K/8K video, wireless communication bandwidth in homes and offices is tightening, and telecommuting and teleconference calls are increasing. .” “Low-cost, space-saving Type 1XL modules enable high-speed communications and significantly improve quality.”
The Wi-Fi portion of the module supports connection speeds 1.4 times faster than traditional Wi-Fi compatible devices, offering data rates up to 1200Mbps. Support PCIe 3.0 interface, optional support SDIO 3.0. The Bluetooth 5.3 LE part supports speeds up to 2Mbps via a high-speed four-wire UART interface, with optional support for SDIO and PCM for audio data. And the ultra-small dual-band module is based on the NXP 88W9098 combo chipset, which supports IEEE 802.11a/b/g/n/ac/ax 2×2 multi-user multiple-input multiple-output (MU-MIMO) and Bluetooth 5.3 low energy.
The module measures 19.1mm(L) x 16.5mm(W) x 2.1mm(H) and utilizes highly sophisticated and enhanced hardware mechanisms and algorithms to optimize the final performance of Wi-Fi and Bluetooth coexistence. It will feature a reference antenna design with FCC/IC certification and CE testing to provide lower development costs and faster time to market. It can also be integrated into size and power sensitive electronics for IoT, smart home, audio/video/voice, smart TV and gateway applications.
