Page 184 - Produits Xilinx Inc. - Embarqué - FPGA (réseaux de portes programmables par l’utilisateur)

Référence	Fabricant	Description	paquet	Stock	Number of Logic Elements/Cells	Total RAM Bits	Number of I/O	Number of Gates	Voltage - Supply	Mounting Type	Operating Temperature	Package / Case	Supplier Device Package
XCV600E-8FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	paquet: 680-LBGA Exposed Pad	Stock6 272	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV600E-8FG676C	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 444 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	paquet: 676-BBGA, FCBGA	Stock4 944	15552	294912	444	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV600E-8BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 404 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	paquet: 560-LBGA, Metal	Stock2 496	15552	294912	404	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV600E-8BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 316 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	paquet: 432-LBGA, Metal	Stock6 608	15552	294912	316	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV600E-7HQ240I	Xilinx Inc.	IC FPGA 158 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 158 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	paquet: 240-BFQFP Exposed Pad	Stock47 796	15552	294912	158	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV600E-7HQ240C	Xilinx Inc.	IC FPGA 158 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 158 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	paquet: 240-BFQFP Exposed Pad	Stock2 240	15552	294912	158	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV600E-7FG900I	Xilinx Inc.	IC FPGA 512 I/O 900FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	paquet: 900-BBGA	Stock7 360	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	900-BBGA	900-FBGA (31x31)
XCV600E-7FG900C	Xilinx Inc.	IC FPGA 512 I/O 900FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	paquet: 900-BBGA	Stock2 096	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	900-BBGA	900-FBGA (31x31)
XCV600E-7FG680I	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	paquet: 680-LBGA Exposed Pad	Stock5 760	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV600E-7FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	paquet: 680-LBGA Exposed Pad	Stock5 776	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV600E-7FG676I	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 444 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	paquet: 676-BBGA, FCBGA	Stock2 480	15552	294912	444	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV600E-7FG676C	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 444 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	paquet: 676-BBGA, FCBGA	Stock4 800	15552	294912	444	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV600E-7BG560I	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 404 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	paquet: 560-LBGA, Metal	Stock4 560	15552	294912	404	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV600E-7BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 404 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	paquet: 560-LBGA, Metal	Stock17 988	15552	294912	404	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV600E-7BG432I	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 316 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	paquet: 432-LBGA, Metal	Stock10 776	15552	294912	316	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV600E-7BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 316 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	paquet: 432-LBGA, Metal	Stock6 744	15552	294912	316	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV600E-6HQ240I	Xilinx Inc.	IC FPGA 158 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 158 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	paquet: 240-BFQFP Exposed Pad	Stock7 344	15552	294912	158	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV600E-6HQ240C	Xilinx Inc.	IC FPGA 158 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 158 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	paquet: 240-BFQFP Exposed Pad	Stock4 240	15552	294912	158	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)
XCV600E-6FG900I	Xilinx Inc.	IC FPGA 512 I/O 900FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	paquet: 900-BBGA	Stock6 832	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	900-BBGA	900-FBGA (31x31)
XCV600E-6FG900C	Xilinx Inc.	IC FPGA 512 I/O 900FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 900-BBGA Supplier Device Package: 900-FBGA (31x31)	paquet: 900-BBGA	Stock22 212	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	900-BBGA	900-FBGA (31x31)
XCV600E-6FG680C	Xilinx Inc.	IC FPGA 512 I/O 680FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 512 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 680-LBGA Exposed Pad Supplier Device Package: 680-FTEBGA (40x40)	paquet: 680-LBGA Exposed Pad	Stock6 480	15552	294912	512	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	680-LBGA Exposed Pad	680-FTEBGA (40x40)
XCV600E-6FG676I	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 444 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	paquet: 676-BBGA, FCBGA	Stock4 912	15552	294912	444	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV600E-6FG676C	Xilinx Inc.	IC FPGA 444 I/O 676FBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 444 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 676-BBGA, FCBGA Supplier Device Package: 676-FCBGA (27x27)	paquet: 676-BBGA, FCBGA	Stock5 088	15552	294912	444	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	676-BBGA, FCBGA	676-FCBGA (27x27)
XCV600E-6BG560I	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 404 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	paquet: 560-LBGA, Metal	Stock6 656	15552	294912	404	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV600E-6BG560C	Xilinx Inc.	IC FPGA 404 I/O 560MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 404 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 560-LBGA, Metal Supplier Device Package: 560-MBGA (42.5x42.5)	paquet: 560-LBGA, Metal	Stock4 016	15552	294912	404	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	560-LBGA, Metal	560-MBGA (42.5x42.5)
XCV600E-6BG432I	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 316 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	paquet: 432-LBGA, Metal	Stock9 312	15552	294912	316	985882	1.71 V ~ 1.89 V	Surface Mount	-40°C ~ 100°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV600E-6BG432C	Xilinx Inc.	IC FPGA 316 I/O 432MBGA Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 294912 Number of I/O: 316 Number of Gates: 985882 Voltage - Supply: 1.71 V ~ 1.89 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 432-LBGA, Metal Supplier Device Package: 432-MBGA (40x40)	paquet: 432-LBGA, Metal	Stock5 632	15552	294912	316	985882	1.71 V ~ 1.89 V	Surface Mount	0°C ~ 85°C (TJ)	432-LBGA, Metal	432-MBGA (40x40)
XCV600-6HQ240C	Xilinx Inc.	IC FPGA 166 I/O 240HQFP Number of LABs/CLBs: 3456 Number of Logic Elements/Cells: 15552 Total RAM Bits: 98304 Number of I/O: 166 Number of Gates: 661111 Voltage - Supply: 2.375 V ~ 2.625 V Mounting Type: Surface Mount Operating Temperature: 0°C ~ 85°C (TJ) Package / Case: 240-BFQFP Exposed Pad Supplier Device Package: 240-PQFP (32x32)	paquet: 240-BFQFP Exposed Pad	Stock14 520	15552	98304	166	661111	2.375 V ~ 2.625 V	Surface Mount	0°C ~ 85°C (TJ)	240-BFQFP Exposed Pad	240-PQFP (32x32)

XCV600E-8FG680C

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 512
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

paquet: 680-LBGA Exposed Pad

Stock6 272

15552

294912

512

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

680-LBGA Exposed Pad

680-FTEBGA (40x40)

XCV600E-8FG676C

Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 444
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

paquet: 676-BBGA, FCBGA

Stock4 944

15552

294912

444

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

676-BBGA, FCBGA

676-FCBGA (27x27)

XCV600E-8BG560C

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 404
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 560-LBGA, Metal
Supplier Device Package: 560-MBGA (42.5x42.5)

paquet: 560-LBGA, Metal

Stock2 496

15552

294912

404

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

560-LBGA, Metal

560-MBGA (42.5x42.5)

XCV600E-8BG432C

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 316
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

paquet: 432-LBGA, Metal

Stock6 608

15552

294912

316

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

432-LBGA, Metal

432-MBGA (40x40)

XCV600E-7HQ240I

Xilinx Inc.

IC FPGA 158 I/O 240HQFP

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 158
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

paquet: 240-BFQFP Exposed Pad

Stock47 796

15552

294912

158

985882

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

240-BFQFP Exposed Pad

240-PQFP (32x32)

XCV600E-7HQ240C

Xilinx Inc.

IC FPGA 158 I/O 240HQFP

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 158
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

paquet: 240-BFQFP Exposed Pad

Stock2 240

15552

294912

158

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

240-BFQFP Exposed Pad

240-PQFP (32x32)

XCV600E-7FG900I

Xilinx Inc.

IC FPGA 512 I/O 900FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 512
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

paquet: 900-BBGA

Stock7 360

15552

294912

512

985882

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

900-BBGA

900-FBGA (31x31)

XCV600E-7FG900C

Xilinx Inc.

IC FPGA 512 I/O 900FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 512
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

paquet: 900-BBGA

Stock2 096

15552

294912

512

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

900-BBGA

900-FBGA (31x31)

XCV600E-7FG680I

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 512
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

paquet: 680-LBGA Exposed Pad

Stock5 760

15552

294912

512

985882

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

680-LBGA Exposed Pad

680-FTEBGA (40x40)

XCV600E-7FG680C

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 512
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

paquet: 680-LBGA Exposed Pad

Stock5 776

15552

294912

512

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

680-LBGA Exposed Pad

680-FTEBGA (40x40)

XCV600E-7FG676I

Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 444
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

paquet: 676-BBGA, FCBGA

Stock2 480

15552

294912

444

985882

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

676-BBGA, FCBGA

676-FCBGA (27x27)

XCV600E-7FG676C

Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 444
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

paquet: 676-BBGA, FCBGA

Stock4 800

15552

294912

444

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

676-BBGA, FCBGA

676-FCBGA (27x27)

XCV600E-7BG560I

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 404
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 560-LBGA, Metal
Supplier Device Package: 560-MBGA (42.5x42.5)

paquet: 560-LBGA, Metal

Stock4 560

15552

294912

404

985882

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

560-LBGA, Metal

560-MBGA (42.5x42.5)

XCV600E-7BG560C

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 404
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 560-LBGA, Metal
Supplier Device Package: 560-MBGA (42.5x42.5)

paquet: 560-LBGA, Metal

Stock17 988

15552

294912

404

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

560-LBGA, Metal

560-MBGA (42.5x42.5)

XCV600E-7BG432I

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 316
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

paquet: 432-LBGA, Metal

Stock10 776

15552

294912

316

985882

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

432-LBGA, Metal

432-MBGA (40x40)

XCV600E-7BG432C

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 316
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

paquet: 432-LBGA, Metal

Stock6 744

15552

294912

316

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

432-LBGA, Metal

432-MBGA (40x40)

XCV600E-6HQ240I

Xilinx Inc.

IC FPGA 158 I/O 240HQFP

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 158
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

paquet: 240-BFQFP Exposed Pad

Stock7 344

15552

294912

158

985882

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

240-BFQFP Exposed Pad

240-PQFP (32x32)

XCV600E-6HQ240C

Xilinx Inc.

IC FPGA 158 I/O 240HQFP

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 158
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

paquet: 240-BFQFP Exposed Pad

Stock4 240

15552

294912

158

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

240-BFQFP Exposed Pad

240-PQFP (32x32)

XCV600E-6FG900I

Xilinx Inc.

IC FPGA 512 I/O 900FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 512
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

paquet: 900-BBGA

Stock6 832

15552

294912

512

985882

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

900-BBGA

900-FBGA (31x31)

XCV600E-6FG900C

Xilinx Inc.

IC FPGA 512 I/O 900FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 512
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 900-BBGA
Supplier Device Package: 900-FBGA (31x31)

paquet: 900-BBGA

Stock22 212

15552

294912

512

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

900-BBGA

900-FBGA (31x31)

XCV600E-6FG680C

Xilinx Inc.

IC FPGA 512 I/O 680FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 512
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 680-LBGA Exposed Pad
Supplier Device Package: 680-FTEBGA (40x40)

paquet: 680-LBGA Exposed Pad

Stock6 480

15552

294912

512

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

680-LBGA Exposed Pad

680-FTEBGA (40x40)

XCV600E-6FG676I

Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 444
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

paquet: 676-BBGA, FCBGA

Stock4 912

15552

294912

444

985882

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

676-BBGA, FCBGA

676-FCBGA (27x27)

XCV600E-6FG676C

Xilinx Inc.

IC FPGA 444 I/O 676FBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 444
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 676-BBGA, FCBGA
Supplier Device Package: 676-FCBGA (27x27)

paquet: 676-BBGA, FCBGA

Stock5 088

15552

294912

444

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

676-BBGA, FCBGA

676-FCBGA (27x27)

XCV600E-6BG560I

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 404
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 560-LBGA, Metal
Supplier Device Package: 560-MBGA (42.5x42.5)

paquet: 560-LBGA, Metal

Stock6 656

15552

294912

404

985882

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

560-LBGA, Metal

560-MBGA (42.5x42.5)

XCV600E-6BG560C

Xilinx Inc.

IC FPGA 404 I/O 560MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 404
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 560-LBGA, Metal
Supplier Device Package: 560-MBGA (42.5x42.5)

paquet: 560-LBGA, Metal

Stock4 016

15552

294912

404

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

560-LBGA, Metal

560-MBGA (42.5x42.5)

XCV600E-6BG432I

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 316
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 100°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

paquet: 432-LBGA, Metal

Stock9 312

15552

294912

316

985882

1.71 V ~ 1.89 V

Surface Mount

-40°C ~ 100°C (TJ)

432-LBGA, Metal

432-MBGA (40x40)

XCV600E-6BG432C

Xilinx Inc.

IC FPGA 316 I/O 432MBGA

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 294912
Number of I/O: 316
Number of Gates: 985882
Voltage - Supply: 1.71 V ~ 1.89 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 432-LBGA, Metal
Supplier Device Package: 432-MBGA (40x40)

paquet: 432-LBGA, Metal

Stock5 632

15552

294912

316

985882

1.71 V ~ 1.89 V

Surface Mount

0°C ~ 85°C (TJ)

432-LBGA, Metal

432-MBGA (40x40)

XCV600-6HQ240C

Xilinx Inc.

IC FPGA 166 I/O 240HQFP

Number of LABs/CLBs: 3456
Number of Logic Elements/Cells: 15552
Total RAM Bits: 98304
Number of I/O: 166
Number of Gates: 661111
Voltage - Supply: 2.375 V ~ 2.625 V
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 85°C (TJ)
Package / Case: 240-BFQFP Exposed Pad
Supplier Device Package: 240-PQFP (32x32)

paquet: 240-BFQFP Exposed Pad

Stock14 520

15552

98304

166

661111

2.375 V ~ 2.625 V

Surface Mount

0°C ~ 85°C (TJ)

240-BFQFP Exposed Pad

240-PQFP (32x32)