Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16SOP
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock5 504 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock24 000 |
|
1 | 1:2 | Yes/Yes | Clock | Clock | - | 3 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock23 280 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3.2GHZ 16MLF
|
paquet: 16-VQFN Exposed Pad, 16-MLF? |
Stock52 884 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 3.2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 267MHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock7 848 |
|
1 | 2:4 | Yes/Yes | HCSL, LVDS | HCSL, LVDS | 267MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:9 134MHZ 16SOIC
|
paquet: 16-SOIC (0.154", 3.90mm Width) |
Stock8 712 |
|
1 | 1:9 | No/No | Clock | Clock | 134MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-SOIC (0.154", 3.90mm Width) | 16-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:8 800MHZ 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock7 476 |
|
1 | 2:8 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 800MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:3 150MHZ 6SOT23
|
paquet: SOT-23-6 |
Stock7 664 |
|
1 | 1:3 | No/No | LVCMOS, Sine Wave | LVCMOS | 150MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | SOT-23-6 | SOT-23-6 |
||
Microchip Technology |
IC CLK BUFFER 2:22 2GHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock26 964 |
|
1 | 2:22 | Yes/Yes | LVDS, LVPECL | LVPECL | 2GHz | 2.37 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 1:16 500MHZ 48TQFP
|
paquet: 48-TQFP |
Stock4 992 |
|
1 | 1:16 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 48-TQFP | 48-TQFP (7x7) |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
paquet: 44-VFQFN Exposed Pad, 44-MLF? |
Stock6 192 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
paquet: 44-VFQFN Exposed Pad, 44-MLF? |
Stock6 912 |
|
1 | 2:10 | Yes/Yes | CML, LVDS, PECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 44-VFQFN Exposed Pad, 44-MLF? | 44-MLF? (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock38 400 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 3GHZ 8MSOP
|
paquet: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
Stock27 336 |
|
1 | 1:2 | Yes/Yes | LVECL, LVPECL | LVECL, LVPECL | 3GHz | 2.375 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) | 8-MSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 4GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock16 836 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, PECL | LVPECL | 4GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:20 2GHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock6 384 |
|
1 | 2:20 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:6 7GHZ 32MLF
|
paquet: 32-VFQFN Exposed Pad, 32-MLF? |
Stock17 100 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | LVPECL | 7GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:8 5.5GHZ 32MLF
|
paquet: 32-VFQFN Exposed Pad, 32-MLF? |
Stock7 044 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:2 5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock107 220 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | LVPECL | 5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 4.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock7 332 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock6 064 |
|
1 | 1:3 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVPECL | 2.5GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:8 1.5GHZ 32MLF
|
paquet: 32-VFQFN Exposed Pad, 32-MLF? |
Stock14 772 |
|
1 | 1:8 | Yes/Yes | CML, LVDS, PECL | LVPECL | 1.5GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:8 2GHZ 32MLF
|
paquet: 32-VFQFN Exposed Pad, 32-MLF? |
Stock7 416 |
|
1 | 2:8 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:2 3.2GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock9 492 |
|
1 | 1:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 3.2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 2GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock32 844 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 2.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock6 312 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 2.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:6 3GHZ 32MLF
|
paquet: 32-VFQFN Exposed Pad, 32-MLF? |
Stock3 424 |
|
1 | 2:6 | Yes/Yes | CML, LVDS, PECL | LVPECL | 3GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 32MLF
|
paquet: 32-VFQFN Exposed Pad, 32-MLF? |
Stock51 948 |
|
1 | 2:5 | Yes/Yes | CML, LVDS, PECL | LVPECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |