Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 2:4 1GHZ 16QFN
|
paquet: 16-WFQFN Exposed Pad |
Stock3 872 |
|
1 | 2:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 32LQFP
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 632 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 2:10 700MHZ 32LQFP
|
paquet: 32-LQFP Exposed Pad |
Stock4 896 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 32-LQFP Exposed Pad | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:1 1GHz
|
paquet: 16-WFQFN Exposed Pad |
Stock5 824 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, Sine Wave, TTL | PECL | 1GHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:3 40MHZ
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 184 |
|
1 | 1:3 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:1 1GHZ
|
paquet: 16-WFQFN Exposed Pad |
Stock2 224 |
|
1 | 1:1 | No/Yes | CMOS, LVDS, Sine Wave, TTL | PECL | 1GHz | 2.5 V ~ 3.3 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:4 235MHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock2 496 |
|
1 | 2:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 235MHz | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 200MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 304 |
|
1 | 1:4 | No/No | LVCMOS, LVTTL | LVCMOS, LVTTL | 200MHz | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 3:4 266MHZ 16QFN
|
paquet: 16-VFQFN Exposed Pad |
Stock2 032 |
|
1 | 3:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3.5x3) |
||
Microchip Technology |
IC CLK BUFFER 3:4 266MHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock10 764 |
|
1 | 3:4 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock41 520 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock2 864 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 1GHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock6 528 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 1GHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:6 40MHZ 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock5 424 |
|
1 | 1:6 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16QFN
|
paquet: 16-WFQFN Exposed Pad |
Stock6 576 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16QFN
|
paquet: 16-WFQFN Exposed Pad |
Stock6 848 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 16-WFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 40MHZ 16TSSOP
|
paquet: 16-TSSOP (0.173", 4.40mm Width) |
Stock5 040 |
|
1 | 1:4 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-TSSOP (0.173", 4.40mm Width) | 16-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 1:2 40MHZ 6DFN
|
paquet: 6-UFDFN Exposed Pad |
Stock4 448 |
|
1 | 1:2 | No/No | Crystal | LVCMOS | 40MHz | 1.62 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 6-UFDFN Exposed Pad | 6-DFN (1.3x2) |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 664 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16QFN
|
paquet: - |
Stock5 088 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16QFN
|
paquet: - |
Stock2 032 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16TSSOP
|
paquet: - |
Stock5 760 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:4 150MHZ 16TSSOP
|
paquet: - |
Stock4 400 |
|
1 | 1:4 | No/No | LVCMOS | LVCMOS | 150MHz | 2.25 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:1 266MHZ 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 456 |
|
1 | 1:1 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOP |
||
Microchip Technology |
IC CLK BUFFER LVCMOS 33QFN
|
paquet: - |
Stock7 264 |
|
1 | 1:1 | No/Yes | LVCMOS, LVTTL | LVPECL | 266MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | - | - |
||
Microchip Technology |
IC CLK BUFFER 1:1 200MHZ 8TSSOP
|
paquet: 8-TSSOP (0.173", 4.40mm Width) |
Stock5 584 |
|
1 | 1:1 | No/No | LVCMOS, Sine Wave | LVCMOS | 200MHz | 2.5 V ~ 3.3 V | -40°C ~ 85°C | Surface Mount | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:9 700MHZ 32LQFP
|
paquet: 32-LQFP Exposed Pad |
Stock7 728 |
|
1 | 2:9 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 32-LQFP Exposed Pad | 32-LQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:10 700MHZ 32LQFP
|
paquet: 32-LQFP Exposed Pad |
Stock5 376 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 700MHz | 2.375 V ~ 3.63 V | 0°C ~ 70°C | Surface Mount | 32-LQFP Exposed Pad | 32-LQFP (7x7) |