Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
paquet: 32-TQFP |
Stock6 336 |
|
1 | 2:9 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 750MHZ 32TQFP
|
paquet: 32-TQFP |
Stock6 832 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 750MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 750MHZ 32TQFP
|
paquet: 32-TQFP |
Stock5 104 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 750MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:1 4.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock7 600 |
|
2 | 1:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 4:2 4.5GHZ 32MLF
|
paquet: 32-VFQFN Exposed Pad, 32-MLF? |
Stock6 464 |
|
1 | 4:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:4 4.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock6 416 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock2 560 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 3.8 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock5 984 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock5 376 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, LVPECL | ECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 4:2 4.5GHZ 32MLF
|
paquet: 32-VFQFN Exposed Pad, 32-MLF? |
Stock7 184 |
|
1 | 4:2 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:4 4.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock6 576 |
|
1 | 1:4 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 2:5 2GHZ 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock7 168 |
|
1 | 2:5 | Yes/Yes | ECL, HSTL, LVPECL | ECL | 2GHz | 2.375 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
paquet: 32-TQFP |
Stock5 552 |
|
1 | 2:9 | Yes/Yes | HCSL, LVDS, LVHSTL, LVPECL, SSTL | LVPECL | 500MHz | 3.135 V ~ 3.465 V | 0°C ~ 70°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:1 4.5GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock4 704 |
|
2 | 1:1 | Yes/Yes | CML, LVDS, LVPECL | CML | 4.5GHz | 2.375 V ~ 2.625 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 2GHZ 16MLF
|
paquet: 16-VFQFN Exposed Pad, 16-MLF? |
Stock7 728 |
|
1 | 1:2 | Yes/Yes | CML, HSTL, LVDS, LVPECL | LVDS | 2GHz | 2.97 V ~ 3.63 V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad, 16-MLF? | 16-MLF? (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock19 800 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 5.5 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUFFER 1:9 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock2 272 |
|
1 | 1:9 | Yes/Yes | PECL | PECL | - | 3 V ~ 3.8 V | 0°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC CLK BUF 4:20/2:10 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock2 304 |
|
1 or 2 | 4:20, 2:10 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.3 V ~ 3.47 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUF 4:20/2:10 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock7 424 |
|
1 or 2 | 4:20, 2:10 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.3 V ~ 3.47 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock3 248 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | - | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock15 288 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | - | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 500MHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock2 656 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:22 500MHZ 64TQFP
|
paquet: 64-TQFP Exposed Pad |
Stock15 252 |
|
1 | 2:22 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 64-TQFP Exposed Pad | 64-EP-TQFP |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
paquet: 32-TQFP |
Stock5 664 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
paquet: 32-TQFP |
Stock16 896 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3 V ~ 3.6 V | 0°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
paquet: 32-TQFP |
Stock3 120 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
paquet: 32-TQFP |
Stock7 104 |
|
1 | 2:9 | Yes/Yes | HSTL, LVPECL | HSTL | 500MHz | 3.15 V ~ 3.45 V | -40°C ~ 85°C | Surface Mount | 32-TQFP | 32-TQFP (7x7) |
||
Microchip Technology |
IC CLK BUFFER 1:4 160MHZ 16SOIC
|
paquet: 16-SOIC (0.295", 7.50mm Width) |
Stock5 328 |
|
1 | 1:4 | Yes/Yes | PECL | TTL | 160MHz | 4.75 V ~ 5.25 V | 0°C ~ 85°C | Surface Mount | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC |