Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
For Use With/Related Products |
---|---|---|---|---|---|---|---|
Vicor Corporation |
HEX STANDOFF 0.525"
|
paquet: - |
Stock8 352 |
|
VICOR Maxi, Mini, Micro-Sized Modules |
||
TDK-Lambda Americas Inc. |
HEATSINK
|
paquet: - |
Stock3 006 |
|
PH300F, PH600S Series Power Supplies |
||
Vicor Corporation |
FILTER ACTIVE EMI 48V 7A LGA
|
paquet: - |
Stock6 390 |
|
DC DC Converters |
||
Texas Instruments |
BOOSTER(PT4484) 20A 48VIN HZ SMD
|
paquet: - |
Stock8 748 |
|
PT4484 |
||
Texas Instruments |
BOOSTER(PT4484) 20A 48VIN HRZ
|
paquet: - |
Stock7 326 |
|
PT4484 |
||
TDK-Lambda Americas Inc. |
HEAT SINK FOR PH50 SERIES DC-DC
|
paquet: - |
Stock4 464 |
|
PH50 Series |
||
TDK-Lambda Americas Inc. |
COMMON MODE CHOKE
|
paquet: - |
Stock6 660 |
|
- |
||
Vicor Corporation |
HEAT SINK FOR DCDC CNVTR/ARRAYS
|
paquet: - |
Stock2 736 |
|
VI Chip? DC DC Converters, VIPAC Arrays |
||
Vicor Corporation |
HEAT SINK FOR DCDC CNVTR/ARRAYS
|
paquet: - |
Stock8 406 |
|
VI Chip? DC DC Converters, VIPAC Arrays |
||
Vicor Corporation |
HEAT SINK FOR DCDC CNVTR/ARRAYS
|
paquet: - |
Stock6 192 |
|
VI Chip? DC DC Converters, VIPAC Arrays |
||
Vicor Corporation |
HEAT SINK FOR DCDC CNVTR/ARRAYS
|
paquet: - |
Stock3 508 |
|
VI Chip? DC DC Converters, VIPAC Arrays |
||
TDK-Lambda Americas Inc. |
THERMAL PAD
|
paquet: - |
Stock3 600 |
|
- |
||
TDK-Lambda Americas Inc. |
HIGH CURRENT SOCKET
|
paquet: - |
Stock3 996 |
|
- |
||
Artesyn Embedded Technologies |
HEATSINK (60) 57.5X59X15MM HORZ
|
paquet: - |
Stock8 208 |
|
AMPSS? |
||
Vicor Corporation |
INMATE MICRO OUT XL
|
paquet: - |
Stock7 254 |
|
VICOR Micro-Sized Modules |
||
Artesyn Embedded Technologies |
PAD THERMAL 1/2 BRICK
|
paquet: - |
Stock5 544 |
|
- |
||
Vicor Corporation |
HALF PUSH-PIN BLU 0.125" 100/BAG
|
paquet: - |
Stock7 992 |
|
VI Chip? Modules |
||
Vicor Corporation |
INMATE MAXI OUT LL BOB
|
paquet: - |
Stock6 156 |
|
VICOR MAXI-Sized Modules |
||
Vicor Corporation |
FULL PUSH-PIN GY 0.150" 100/BAG
|
paquet: - |
Stock8 442 |
|
VI Chip? Modules |
||
Vicor Corporation |
HEATSINK VI-200 HORIZ. 0.9"
|
paquet: - |
Stock8 424 |
|
VICOR VI-200S-Sized Modules |
||
Vicor Corporation |
HEATSINK MINI 0.9" THRD/LONG
|
paquet: - |
Stock6 924 |
|
VICOR VI-J00-Sized Modules |
||
Vicor Corporation |
STANDOFF KIT .420 F-F
|
paquet: - |
Stock8 532 |
|
VICOR InMate Mounted Modules |
||
Vicor Corporation |
HALF 11MM TALL CROSS FLOW PINS
|
paquet: - |
Stock6 264 |
|
VI Chip? Modules |
||
Vicor Corporation |
VI-RAM RIPPLE ATTENUATOR MODULE
|
paquet: - |
Stock7 308 |
|
VICOR VI-200, VI-J00, FlatPACs, ComPACS, MegaMods |
||
Vicor Corporation |
INMATE SOCKET MAXI 5IN/5OUT SET
|
paquet: - |
Stock9 372 |
|
VICOR MAXI-Sized Modules |
||
Vicor Corporation |
3-30V 10A OUT RIPPLE ATTENUATOR
|
paquet: - |
Stock16 416 |
|
DC DC Converters |
||
Vicor Corporation |
HEATSINK MICRO 0.4" THRU/LONG
|
paquet: - |
Stock10 020 |
|
VICOR Micro-Sized Modules |
||
Vicor Corporation |
STANDOFF KIT .403 F-F
|
paquet: - |
Stock18 708 |
|
VICOR InMate Mounted Modules |
||
Vicor Corporation |
FULL 11MM LONGITUDINAL FLOW PINS
|
paquet: - |
Stock22 374 |
|
VI Chip? Modules |
||
Vicor Corporation |
INMATE MAXI/MINI IN SL BOB
|
paquet: - |
Stock21 564 |
|
VICOR Maxi, Mini-Sized Modules |