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Produits NXP - Embarqués - Microcontrôleurs

Dossiers 7 823
Page  260/261
Image
Référence
Fabricant
Description
paquet
Stock
Quantité
Core Size
Speed
Connectivity
Peripherals
Number of I/O
Program Memory Size
Program Memory Type
EEPROM Size
RAM Size
Voltage - Supply (Vcc/Vdd)
Data Converters
Oscillator Type
Operating Temperature
Mounting Type
Package / Case
Supplier Device Package
S912ZVML12F1VKHR
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock5 728
16-Bit
50MHz
CAN, LIN, SCI, SPI
DMA, POR, PWM, WDT
42
128KB (128K x 8)
FLASH
512 x 8
8K x 8
4.5 V ~ 5.5 V
A/D 9x12b
Internal
-40°C ~ 105°C (TA)
-
64-LQFP Exposed Pad
64-LQFP EP (10x10)
S912ZVML12F1VKH
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock2 432
16-Bit
50MHz
CAN, LIN, SCI, SPI
DMA, POR, PWM, WDT
42
128KB (128K x 8)
FLASH
512 x 8
8K x 8
4.5 V ~ 5.5 V
A/D 9x12b
Internal
-40°C ~ 105°C (TA)
-
64-LQFP Exposed Pad
64-LQFP EP (10x10)
S912ZVML12F1MKHR
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock6 416
16-Bit
50MHz
CAN, LIN, SCI, SPI
DMA, POR, PWM, WDT
42
128KB (128K x 8)
FLASH
512 x 8
8K x 8
4.5 V ~ 5.5 V
A/D 9x12b
Internal
-40°C ~ 125°C (TA)
-
64-LQFP Exposed Pad
64-LQFP EP (10x10)
S912ZVMC64F1WKH
NXP

IC MCU 16BIT 64KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock3 328
16-Bit
50MHz
CAN, LIN, SCI, SPI
DMA, POR, PWM, WDT
42
64KB (64K x 8)
FLASH
512 x 8
4K x 8
4.5 V ~ 5.5 V
A/D 9x12b
Internal
-40°C ~ 150°C (TA)
-
64-LQFP Exposed Pad
64-LQFP EP (10x10)
S912ZVMC64F1VKH
NXP

IC MCU 16BIT 64KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock4 896
16-Bit
50MHz
CAN, LIN, SCI, SPI
DMA, POR, PWM, WDT
42
64KB (64K x 8)
FLASH
512 x 8
4K x 8
4.5 V ~ 5.5 V
A/D 9x12b
Internal
-40°C ~ 105°C (TA)
-
64-LQFP Exposed Pad
64-LQFP EP (10x10)
S912ZVMC64F1MKHR
NXP

IC MCU 16BIT 64KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock4 432
16-Bit
50MHz
CAN, LIN, SCI, SPI
DMA, POR, PWM, WDT
42
64KB (64K x 8)
FLASH
512 x 8
4K x 8
4.5 V ~ 5.5 V
A/D 9x12b
Internal
-40°C ~ 125°C (TA)
-
64-LQFP Exposed Pad
64-LQFP EP (10x10)
S912ZVMC64F1MKH
NXP

IC MCU 16BIT 64KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 4K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock7 728
16-Bit
50MHz
CAN, LIN, SCI, SPI
DMA, POR, PWM, WDT
42
64KB (64K x 8)
FLASH
512 x 8
4K x 8
4.5 V ~ 5.5 V
A/D 9x12b
Internal
-40°C ~ 125°C (TA)
-
64-LQFP Exposed Pad
64-LQFP EP (10x10)
S912ZVMC12F2WKHR
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock2 208
16-Bit
50MHz
CAN, LIN, SCI, SPI
DMA, POR, PWM, WDT
42
128KB (128K x 8)
FLASH
512 x 8
8K x 8
4.5 V ~ 5.5 V
A/D 9x12b
Internal
-40°C ~ 150°C (TA)
-
64-LQFP Exposed Pad
64-LQFP EP (10x10)
S912ZVMC12F2WKH
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock3 728
16-Bit
50MHz
CAN, LIN, SCI, SPI
DMA, POR, PWM, WDT
42
128KB (128K x 8)
FLASH
512 x 8
8K x 8
4.5 V ~ 5.5 V
A/D 9x12b
Internal
-40°C ~ 150°C (TA)
-
64-LQFP Exposed Pad
64-LQFP EP (10x10)
S912ZVMC12F1MKHR
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock6 176
16-Bit
50MHz
CAN, LIN, SCI, SPI
DMA, POR, PWM, WDT
42
128KB (128K x 8)
FLASH
512 x 8
8K x 8
4.5 V ~ 5.5 V
A/D 9x12b
Internal
-40°C ~ 125°C (TA)
-
64-LQFP Exposed Pad
64-LQFP EP (10x10)
SPC5777CK2MMO3R
NXP

IC MCU 32BIT 8MB FLASH 516BGA

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock5 008
32-Bit Tri-Core
264MHz
CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5777CK2MME3R
NXP

IC MCU 32BIT 8MB FLASH 416BGA

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
paquet: 416-BGA
Stock3 536
32-Bit Tri-Core
264MHz
CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
416-BGA
416-MAPBGA (27x27)
SC8568EVTANGG
NXP

IC MCU

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock6 496
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SC8568ECVTATGG
NXP

IC MCU

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock7 136
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
hot SC34671AEPR2
NXP

IC MCU

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock540 000
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SC34671AEP
NXP

IC MCU

  • Core Processor: -
  • Core Size: -
  • Speed: -
  • Connectivity: -
  • Peripherals: -
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: -
  • EEPROM Size: -
  • RAM Size: -
  • Voltage - Supply (Vcc/Vdd): -
  • Data Converters: -
  • Oscillator Type: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
paquet: -
Stock3 920
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
SVF532R2K1CMK4
NXP

IC MCU 32BIT ROMLESS 364MAPBGA

  • Core Processor: ARM? Cortex?-A5 + Cortex?-M4
  • Core Size: 32-Bit Dual-Core
  • Speed: 400MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
  • Peripherals: LCD, SAI
  • Number of I/O: 136
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 1MB
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 364-LFBGA
  • Supplier Device Package: 364-MAPBGA (17x17)
paquet: 364-LFBGA
Stock3 376
32-Bit Dual-Core
400MHz
CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
LCD, SAI
136
-
ROMless
-
1MB
3 V ~ 3.6 V
A/D 10x12b
Internal
-40°C ~ 85°C (TA)
-
364-LFBGA
364-MAPBGA (17x17)
SVF531R3K1CMK4
NXP

IC MCU 32BIT ROMLESS 364MAPBGA

  • Core Processor: ARM? Cortex?-A5 + Cortex?-M4
  • Core Size: 32-Bit Dual-Core
  • Speed: 400MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
  • Peripherals: LCD, SAI
  • Number of I/O: 136
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 1.5MB
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 364-LFBGA
  • Supplier Device Package: 364-MAPBGA (17x17)
paquet: 364-LFBGA
Stock5 648
32-Bit Dual-Core
400MHz
CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
LCD, SAI
136
-
ROMless
-
1.5MB
3 V ~ 3.6 V
A/D 10x12b
Internal
-40°C ~ 85°C (TA)
-
364-LFBGA
364-MAPBGA (17x17)
SVF332R3K1CKU2
NXP

IC MCU 32BIT ROMLESS 176LQFP

  • Core Processor: ARM? Cortex?-A5 + Cortex?-M4
  • Core Size: 32-Bit Dual-Core
  • Speed: 266MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
  • Peripherals: LCD, SAI
  • Number of I/O: 115
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 1.5MB
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock4 640
32-Bit Dual-Core
266MHz
CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
LCD, SAI
115
-
ROMless
-
1.5MB
3 V ~ 3.6 V
A/D 10x12b
Internal
-40°C ~ 85°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
hot SVF331R3K1CKU2
NXP

IC MCU 32BIT ROMLESS 176LQFP

  • Core Processor: ARM? Cortex?-A5 + Cortex?-M4
  • Core Size: 32-Bit Dual-Core
  • Speed: 266MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
  • Peripherals: LCD, SAI
  • Number of I/O: 115
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 1.5MB
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D 10x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 176-LQFP Exposed Pad
  • Supplier Device Package: 176-LQFP (24x24)
paquet: 176-LQFP Exposed Pad
Stock3 904
32-Bit Dual-Core
266MHz
CAN, EBI/EMI, Ethernet, I2C, SD, SPI, UART/USART, USB OTG
LCD, SAI
115
-
ROMless
-
1.5MB
3 V ~ 3.6 V
A/D 10x12b
Internal
-40°C ~ 85°C (TA)
-
176-LQFP Exposed Pad
176-LQFP (24x24)
MVF62NN151CMK4
NXP

IC MCU 32BIT ROMLESS 364MAPBGA

  • Core Processor: ARM? Cortex?-A5 + Cortex?-M4
  • Core Size: 32-Bit Dual-Core
  • Speed: 400MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
  • Peripherals: DMA, LVD, WDT
  • Number of I/O: -
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 1.5MB
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 3.6 V
  • Data Converters: A/D Dual x 12b, D/A Dual x 12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 364-LFBGA
  • Supplier Device Package: 364-MAPBGA (17x17)
paquet: 364-LFBGA
Stock2 160
32-Bit Dual-Core
400MHz
CAN, EBI/EMI, Ethernet, I2C, IrDA, LIN, SCI, SD, SPI, UART/USART, USB OTG
DMA, LVD, WDT
-
-
ROMless
-
1.5MB
3 V ~ 3.6 V
A/D Dual x 12b, D/A Dual x 12b
Internal
-40°C ~ 85°C (TA)
-
364-LFBGA
364-MAPBGA (17x17)
P89LPC925FDHY
NXP

IC MCU 8BIT 8KB FLASH 20TSSOP

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 18MHz
  • Connectivity: I2C, UART/USART
  • Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
  • Number of I/O: 18
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 256 x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: A/D 4x8b; D/A 1x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 20-TSSOP
paquet: 20-TSSOP (0.173", 4.40mm Width)
Stock6 720
8-Bit
18MHz
I2C, UART/USART
Brown-out Detect/Reset, LED, POR, PWM, WDT
18
8KB (8K x 8)
FLASH
-
256 x 8
2.4 V ~ 3.6 V
A/D 4x8b; D/A 1x8b
Internal
-40°C ~ 85°C (TA)
-
20-TSSOP (0.173", 4.40mm Width)
20-TSSOP
SPC5777CK2MME3
NXP

IC MCU 32BIT 8MB FLASH 416BGA

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 416-BGA
  • Supplier Device Package: 416-MAPBGA (27x27)
paquet: 416-BGA
Stock5 696
32-Bit Tri-Core
264MHz
CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
416-BGA
416-MAPBGA (27x27)
SPC5777CK2MMO3
NXP

IC MCU 32BIT 8MB FLASH 516BGA

  • Core Processor: e200z7
  • Core Size: 32-Bit Tri-Core
  • Speed: 264MHz
  • Connectivity: CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
  • Peripherals: DMA, LVD, POR, Zipwire
  • Number of I/O: -
  • Program Memory Size: 8MB (8M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 512K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 16b Sigma-Delta, eQADC
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 516-BGA
  • Supplier Device Package: 516-MAPBGA (27x27)
paquet: 516-BGA
Stock3 168
32-Bit Tri-Core
264MHz
CAN, EBI/EMI, Ethernet, FlexCAN, LIN, SCI, SPI
DMA, LVD, POR, Zipwire
-
8MB (8M x 8)
FLASH
-
512K x 8
3 V ~ 5.5 V
A/D 16b Sigma-Delta, eQADC
Internal
-40°C ~ 125°C (TA)
-
516-BGA
516-MAPBGA (27x27)
SPC5748GK1MMN6
NXP

IC MCU 32BIT 6MB FLASH 324MAPBGA

  • Core Processor: e200z2, e200z4, e200z4
  • Core Size: 32-Bit Tri-Core
  • Speed: 80MHz/160MHz
  • Connectivity: CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
  • Peripherals: DMA, LVD, POR, WDT
  • Number of I/O: 246
  • Program Memory Size: 6MB (6M x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 768K x 8
  • Voltage - Supply (Vcc/Vdd): 3 V ~ 5.5 V
  • Data Converters: A/D 80x10b, 64x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 324-LFBGA
  • Supplier Device Package: 324-MAPBGA (19x19)
paquet: 324-LFBGA
Stock7 504
32-Bit Tri-Core
80MHz/160MHz
CAN, Ethernet, I2C, LIN, SAI, SPI, USB, USB OTG
DMA, LVD, POR, WDT
246
6MB (6M x 8)
FLASH
-
768K x 8
3 V ~ 5.5 V
A/D 80x10b, 64x12b
Internal
-40°C ~ 125°C (TA)
-
324-LFBGA
324-MAPBGA (19x19)
P89LPC935FDH,518
NXP

IC MCU 8BIT 8KB FLASH 28TSSOP

  • Core Processor: 8051
  • Core Size: 8-Bit
  • Speed: 12MHz
  • Connectivity: I2C, SPI, UART/USART
  • Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
  • Number of I/O: 26
  • Program Memory Size: 8KB (8K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 768 x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: A/D 8x8b; D/A 2x8b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 28-TSSOP (0.173", 4.40mm Width)
  • Supplier Device Package: 28-TSSOP
paquet: 28-TSSOP (0.173", 4.40mm Width)
Stock5 824
8-Bit
12MHz
I2C, SPI, UART/USART
Brown-out Detect/Reset, LED, POR, PWM, WDT
26
8KB (8K x 8)
FLASH
512 x 8
768 x 8
2.4 V ~ 3.6 V
A/D 8x8b; D/A 2x8b
Internal
-40°C ~ 85°C (TA)
-
28-TSSOP (0.173", 4.40mm Width)
28-TSSOP
MC56F82748MLHR
NXP

IC MCU 32BIT 64KB FLASH 64LQFP

  • Core Processor: 56800EX
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, I2C, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
  • Data Converters: A/D 16x12b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock7 200
32-Bit
100MHz
CAN, I2C, SCI, SPI
DMA, POR, PWM, WDT
54
64KB (64K x 8)
FLASH
-
8K x 8
2.7 V ~ 3.6 V
A/D 16x12b, D/A 2x12b
Internal
-40°C ~ 125°C (TA)
-
64-LQFP
64-LQFP (10x10)
MC56F82748MLH
NXP

IC MCU 32BIT 64KB FLASH 64LQFP

  • Core Processor: 56800EX
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, I2C, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 54
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
  • Data Converters: A/D 16x12b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
paquet: 64-LQFP
Stock4 304
32-Bit
100MHz
CAN, I2C, SCI, SPI
DMA, POR, PWM, WDT
54
64KB (64K x 8)
FLASH
-
8K x 8
2.7 V ~ 3.6 V
A/D 16x12b, D/A 2x12b
Internal
-40°C ~ 125°C (TA)
-
64-LQFP
64-LQFP (10x10)
LPC1768UKJ
NXP

IC MCU 32BIT 512KB FLASH 100BGA

  • Core Processor: ARM? Cortex?-M3
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 70
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 64K x 8
  • Voltage - Supply (Vcc/Vdd): 2.4 V ~ 3.6 V
  • Data Converters: A/D 8x12b, D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 100-TFBGA
  • Supplier Device Package: 100-TFBGA (9x9)
paquet: 100-TFBGA
Stock3 088
32-Bit
100MHz
CAN, Ethernet, I2C, IrDA, Microwire, SPI, SSI, UART/USART, USB OTG
Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
70
512KB (512K x 8)
FLASH
-
64K x 8
2.4 V ~ 3.6 V
A/D 8x12b, D/A 1x10b
Internal
-40°C ~ 85°C (TA)
-
100-TFBGA
100-TFBGA (9x9)
hot S912ZVML12F1WKH
NXP

IC MCU 16BIT 128KB FLASH 64LQFP

  • Core Processor: S12Z
  • Core Size: 16-Bit
  • Speed: 50MHz
  • Connectivity: CAN, LIN, SCI, SPI
  • Peripherals: DMA, POR, PWM, WDT
  • Number of I/O: 42
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 8K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: A/D 9x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 150°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP Exposed Pad
  • Supplier Device Package: 64-LQFP EP (10x10)
paquet: 64-LQFP Exposed Pad
Stock3 808
16-Bit
50MHz
CAN, LIN, SCI, SPI
DMA, POR, PWM, WDT
42
128KB (128K x 8)
FLASH
512 x 8
8K x 8
4.5 V ~ 5.5 V
A/D 9x12b
Internal
-40°C ~ 150°C (TA)
-
64-LQFP Exposed Pad
64-LQFP EP (10x10)