Page 4 - Produits NXP - Embarqués - Microcontrôleurs - Spécifiques aux applications

Référence	Fabricant	Description	paquet	Stock	Core Processor	Program Memory Type	Controller Series	RAM Size	Interface	Number of I/O	Voltage - Supply	Operating Temperature	Mounting Type	Package / Case	Supplier Device Package
MM908E624AYEW	NXP	IC TRPL SWITCH MCU/LIN 54-SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC	paquet: 54-BSSOP (0.295", 7.50mm Width)	Stock16 848	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	16	5.5 V ~ 18 V	-40°C ~ 125°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width)	54-SOIC
MM908E626AVEK	NXP	IC STEPPER MOTOR DRIVER 54-SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 115°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock15 600	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	13	8 V ~ 18 V	-40°C ~ 115°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width) Exposed Pad	54-SOICW-EP
MM908E625ACEK	NXP	IC HALF-BRIDGE QUAD 54-SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock2 160	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	13	8 V ~ 18 V	-40°C ~ 85°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width) Exposed Pad	54-SOICW-EP
MM908E624ACEW	NXP	IC SWITCH TRIPLE MCU/LIN 54-SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC	paquet: 54-BSSOP (0.295", 7.50mm Width)	Stock61 584	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	16	5.5 V ~ 18 V	-40°C ~ 85°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width)	54-SOIC
MM908E622ACEK	NXP	IC HALF-BRIDGE QUAD 54-SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock5 808	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	12	9 V ~ 16 V	-40°C ~ 85°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width) Exposed Pad	54-SOICW-EP
ASC8849AETE	NXP	IC VIDEO PROCESSOR ADV 484TFBGA Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9? Program Memory Type: - Controller Series: - RAM Size: - Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15)	paquet: 484-TFBGA	Stock7 360	ARM9?	-	-	-	EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG	-	-	-	Surface Mount	484-TFBGA	484-TFBGA (15x15)
ASC8849AETK	NXP	IC VIDEO PROCESSOR ADV 484TFBGA Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9? Program Memory Type: - Controller Series: - RAM Size: - Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15)	paquet: 484-TFBGA	Stock3 104	ARM9?	-	-	-	EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG	-	-	-	Surface Mount	484-TFBGA	484-TFBGA (15x15)
ASC8852AETK	NXP	IC VIDEO PROCESSOR ADV 484TFBGA Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9? Program Memory Type: - Controller Series: - RAM Size: - Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15)	paquet: 484-TFBGA	Stock4 256	ARM9?	-	-	-	EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG	-	-	-	Surface Mount	484-TFBGA	484-TFBGA (15x15)
ASC8851AETE	NXP	IC VIDEO PROCESSOR ADV 484TFBGA Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9? Program Memory Type: - Controller Series: - RAM Size: - Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15)	paquet: 484-TFBGA	Stock13 716	ARM9?	-	-	-	EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG	-	-	-	Surface Mount	484-TFBGA	484-TFBGA (15x15)
ASC8850AETE	NXP	IC VIDEO PROCESSOR ADV 484TFBGA Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9? Program Memory Type: - Controller Series: - RAM Size: - Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15)	paquet: 484-TFBGA	Stock3 920	ARM9?	-	-	-	EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG	-	-	-	Surface Mount	484-TFBGA	484-TFBGA (15x15)
ASC8851AETK	NXP	IC VIDEO PROCESSOR ADV 484TFBGA Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9? Program Memory Type: - Controller Series: - RAM Size: - Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15)	paquet: 484-TFBGA	Stock6 512	ARM9?	-	-	-	EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG	-	-	-	Surface Mount	484-TFBGA	484-TFBGA (15x15)
ASC8850AETK	NXP	IC VIDEO PROCESSOR ADV 484TFBGA Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9? Program Memory Type: - Controller Series: - RAM Size: - Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15)	paquet: 484-TFBGA	Stock7 024	ARM9?	-	-	-	EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG	-	-	-	Surface Mount	484-TFBGA	484-TFBGA (15x15)
ASC8848AETE	NXP	IC VIDEO PROCESSOR ADV 484TFBGA Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9? Program Memory Type: - Controller Series: - RAM Size: - Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15)	paquet: 484-TFBGA	Stock6 768	ARM9?	-	-	-	EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG	-	-	-	Surface Mount	484-TFBGA	484-TFBGA (15x15)
ASC8848AETK	NXP	IC VIDEO PROCESSOR ADV 484TFBGA Applications: Embedded Multimedia Communication, Security and Entertainment Core Processor: ARM9? Program Memory Type: - Controller Series: - RAM Size: - Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG Number of I/O: - Voltage - Supply: - Operating Temperature: - Mounting Type: Surface Mount Package / Case: 484-TFBGA Supplier Device Package: 484-TFBGA (15x15)	paquet: 484-TFBGA	Stock3 552	ARM9?	-	-	-	EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG	-	-	-	Surface Mount	484-TFBGA	484-TFBGA (15x15)
MM908E622ACPEK	NXP	IC QUAD HALF BRDG TRPL SW 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock7 488	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	12	9 V ~ 16 V	-40°C ~ 85°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width) Exposed Pad	54-SOICW-EP
MM912G634DM1AE	NXP	IC MCU 48KB LS/HS SWITCH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	paquet: 48-LQFP Exposed Pad	Stock6 432	S12	FLASH (48 kB)	HCS12	2K x 8	LIN, SCI	9	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MM908E626AVPEK	NXP	IC STEPPER MOTOR DRVR 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 115°C Mounting Type: Surface Mount Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOIC	paquet: 54-SSOP (0.295", 7.50mm Width) Exposed Pad	Stock168 696	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	13	8 V ~ 18 V	-40°C ~ 115°C	Surface Mount	54-SSOP (0.295", 7.50mm Width) Exposed Pad	54-SOIC
MM908E625ACPEK	NXP	IC QUAD HALF-BRIDGE 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 13 Voltage - Supply: 8 V ~ 18 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock7 424	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	13	8 V ~ 18 V	-40°C ~ 85°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width) Exposed Pad	54-SOICW-EP
MM908E622ACPEKR2	NXP	IC QUAD HALF BRDG TRPL SW 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 12 Voltage - Supply: 9 V ~ 16 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 54-SOICW-EP	paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad	Stock7 616	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	12	9 V ~ 16 V	-40°C ~ 85°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width) Exposed Pad	54-SOICW-EP
MM912JS812AMAF	NXP	IC DRVR INJECTOR/IGN 100LQFP Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 8K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	paquet: 100-LQFP Exposed Pad	Stock4 688	S12XS	FLASH (128 kB)	HCS12	8K x 8	CAN, SCI, SPI	6	4.7 V ~ 36 V	-40°C ~ 125°C	Surface Mount	100-LQFP Exposed Pad	100-LQFP-EP (14x14)
MM912G634DM1AER2	NXP	IC MCU 48KB LS/HS SWITCH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Exposed Pad Supplier Device Package: 48-LQFP-EP (7x7)	paquet: 48-LQFP Exposed Pad	Stock6 704	S12	FLASH (48 kB)	HCS12	2K x 8	LIN, SCI	9	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-LQFP Exposed Pad	48-LQFP-EP (7x7)
MM912I637AM2EPR2	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	paquet: 48-VFQFN Exposed Pad	Stock5 984	S12	FLASH (96 KB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 125°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM912I637AM2EP	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	paquet: 48-VFQFN Exposed Pad	Stock2 976	S12	FLASH (96 KB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 125°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM912G634DV2APR2	NXP	IC MCU 48KB LS/HS SWITCH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: 48-LQFP	Stock7 632	S12	FLASH (48 kB)	HCS12	2K x 8	LIN, SCI	9	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-LQFP	48-LQFP (7x7)
MM912KS812AMAFR2	NXP	IC MCU 16BIT HCS12 100LQFP Applications: Engine Control Core Processor: S12XS Program Memory Type: FLASH (256 kB) Controller Series: HCS12 RAM Size: 12K x 8 Interface: CAN, SCI, SPI Number of I/O: 6 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	paquet: 100-LQFP Exposed Pad	Stock4 272	S12XS	FLASH (256 kB)	HCS12	12K x 8	CAN, SCI, SPI	6	4.7 V ~ 36 V	-40°C ~ 125°C	Surface Mount	100-LQFP Exposed Pad	100-LQFP-EP (14x14)
MM912G634DV2AP	NXP	IC MCU 48KB LS/HS SWITCH 48LQFP Applications: Automotive Core Processor: S12 Program Memory Type: FLASH (48 kB) Controller Series: HCS12 RAM Size: 2K x 8 Interface: LIN, SCI Number of I/O: 9 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	paquet: 48-LQFP	Stock143 916	S12	FLASH (48 kB)	HCS12	2K x 8	LIN, SCI	9	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-LQFP	48-LQFP (7x7)
MM908E624AYPEW	NXP	IC SW TRPL HISIDE MCU/LIN 54SOIC Applications: Automotive Mirror Control Core Processor: HC08 Program Memory Type: FLASH (16 kB) Controller Series: 908E RAM Size: 512 x 8 Interface: SCI, SPI Number of I/O: 16 Voltage - Supply: 5.5 V ~ 18 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 54-BSSOP (0.295", 7.50mm Width) Supplier Device Package: 54-SOIC	paquet: 54-BSSOP (0.295", 7.50mm Width)	Stock5 088	HC08	FLASH (16 kB)	908E	512 x 8	SCI, SPI	16	5.5 V ~ 18 V	-40°C ~ 125°C	Surface Mount	54-BSSOP (0.295", 7.50mm Width)	54-SOIC
MM912I637AV1EPR2	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	paquet: 48-VFQFN Exposed Pad	Stock6 160	S12	FLASH (96 KB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM912I637AV1EP	NXP	IC MCU LIN BATT MONITOR 48QFN Applications: Battery Monitor Core Processor: S12 Program Memory Type: FLASH (96 KB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: LIN, SCI, SPI Number of I/O: 8 Voltage - Supply: 2.25 V ~ 5.5 V Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 48-VFQFN Exposed Pad Supplier Device Package: 48-QFN-EP (7x7)	paquet: 48-VFQFN Exposed Pad	Stock7 344	S12	FLASH (96 KB)	HCS12	6K x 8	LIN, SCI, SPI	8	2.25 V ~ 5.5 V	-40°C ~ 105°C	Surface Mount	48-VFQFN Exposed Pad	48-QFN-EP (7x7)
MM912JP812AMAF	NXP	IC DRVR INJECTOR/IGN 100LQFP Applications: Engine Control Core Processor: S12P Program Memory Type: FLASH (128 kB) Controller Series: HCS12 RAM Size: 6K x 8 Interface: CAN, SCI, SPI Number of I/O: 8 Voltage - Supply: 4.7 V ~ 36 V Operating Temperature: -40°C ~ 125°C Mounting Type: Surface Mount Package / Case: 100-LQFP Exposed Pad Supplier Device Package: 100-LQFP-EP (14x14)	paquet: 100-LQFP Exposed Pad	Stock6 016	S12P	FLASH (128 kB)	HCS12	6K x 8	CAN, SCI, SPI	8	4.7 V ~ 36 V	-40°C ~ 125°C	Surface Mount	100-LQFP Exposed Pad	100-LQFP-EP (14x14)

MM908E624AYEW

NXP

IC TRPL SWITCH MCU/LIN 54-SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 16
Voltage - Supply: 5.5 V ~ 18 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 54-SOIC

paquet: 54-BSSOP (0.295", 7.50mm Width)

Stock16 848

HC08

FLASH (16 kB)

908E

512 x 8

SCI, SPI

16

5.5 V ~ 18 V

-40°C ~ 125°C

Surface Mount

54-BSSOP (0.295", 7.50mm Width)

54-SOIC

MM908E626AVEK

NXP

IC STEPPER MOTOR DRIVER 54-SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 13
Voltage - Supply: 8 V ~ 18 V
Operating Temperature: -40°C ~ 115°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock15 600

HC08

FLASH (16 kB)

908E

512 x 8

SCI, SPI

13

8 V ~ 18 V

-40°C ~ 115°C

Surface Mount

54-BSSOP (0.295", 7.50mm Width) Exposed Pad

54-SOICW-EP

MM908E625ACEK

NXP

IC HALF-BRIDGE QUAD 54-SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 13
Voltage - Supply: 8 V ~ 18 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock2 160

HC08

FLASH (16 kB)

908E

512 x 8

SCI, SPI

13

8 V ~ 18 V

-40°C ~ 85°C

Surface Mount

54-BSSOP (0.295", 7.50mm Width) Exposed Pad

54-SOICW-EP

MM908E624ACEW

NXP

IC SWITCH TRIPLE MCU/LIN 54-SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 16
Voltage - Supply: 5.5 V ~ 18 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 54-SOIC

paquet: 54-BSSOP (0.295", 7.50mm Width)

Stock61 584

HC08

FLASH (16 kB)

908E

512 x 8

SCI, SPI

16

5.5 V ~ 18 V

-40°C ~ 85°C

Surface Mount

54-BSSOP (0.295", 7.50mm Width)

54-SOIC

MM908E622ACEK

NXP

IC HALF-BRIDGE QUAD 54-SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 12
Voltage - Supply: 9 V ~ 16 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock5 808

HC08

FLASH (16 kB)

908E

512 x 8

SCI, SPI

12

9 V ~ 16 V

-40°C ~ 85°C

Surface Mount

54-BSSOP (0.295", 7.50mm Width) Exposed Pad

54-SOICW-EP

ASC8849AETE

NXP

IC VIDEO PROCESSOR ADV 484TFBGA

Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9?
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Supplier Device Package: 484-TFBGA (15x15)

paquet: 484-TFBGA

Stock7 360

ARM9?

-

EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG

-

Surface Mount

484-TFBGA

484-TFBGA (15x15)

ASC8849AETK

NXP

IC VIDEO PROCESSOR ADV 484TFBGA

Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9?
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Supplier Device Package: 484-TFBGA (15x15)

paquet: 484-TFBGA

Stock3 104

ARM9?

-

EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG

-

Surface Mount

484-TFBGA

484-TFBGA (15x15)

ASC8852AETK

NXP

IC VIDEO PROCESSOR ADV 484TFBGA

Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9?
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Supplier Device Package: 484-TFBGA (15x15)

paquet: 484-TFBGA

Stock4 256

ARM9?

-

EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG

-

Surface Mount

484-TFBGA

484-TFBGA (15x15)

ASC8851AETE

NXP

IC VIDEO PROCESSOR ADV 484TFBGA

Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9?
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Supplier Device Package: 484-TFBGA (15x15)

paquet: 484-TFBGA

Stock13 716

ARM9?

-

EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG

-

Surface Mount

484-TFBGA

484-TFBGA (15x15)

ASC8850AETE

NXP

IC VIDEO PROCESSOR ADV 484TFBGA

Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9?
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Supplier Device Package: 484-TFBGA (15x15)

paquet: 484-TFBGA

Stock3 920

ARM9?

-

EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG

-

Surface Mount

484-TFBGA

484-TFBGA (15x15)

ASC8851AETK

NXP

IC VIDEO PROCESSOR ADV 484TFBGA

Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9?
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Supplier Device Package: 484-TFBGA (15x15)

paquet: 484-TFBGA

Stock6 512

ARM9?

-

EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG

-

Surface Mount

484-TFBGA

484-TFBGA (15x15)

ASC8850AETK

NXP

IC VIDEO PROCESSOR ADV 484TFBGA

Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9?
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Supplier Device Package: 484-TFBGA (15x15)

paquet: 484-TFBGA

Stock7 024

ARM9?

-

EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG

-

Surface Mount

484-TFBGA

484-TFBGA (15x15)

ASC8848AETE

NXP

IC VIDEO PROCESSOR ADV 484TFBGA

Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9?
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Supplier Device Package: 484-TFBGA (15x15)

paquet: 484-TFBGA

Stock6 768

ARM9?

-

EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG

-

Surface Mount

484-TFBGA

484-TFBGA (15x15)

ASC8848AETK

NXP

IC VIDEO PROCESSOR ADV 484TFBGA

Applications: Embedded Multimedia Communication, Security and Entertainment
Core Processor: ARM9?
Program Memory Type: -
Controller Series: -
RAM Size: -
Interface: EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG
Number of I/O: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: 484-TFBGA
Supplier Device Package: 484-TFBGA (15x15)

paquet: 484-TFBGA

Stock3 552

ARM9?

-

EBI/EMI, Ethernet, I2S, IrDA, SD/MMC, SPI, UART/USART, USB OTG

-

Surface Mount

484-TFBGA

484-TFBGA (15x15)

MM908E622ACPEK

NXP

IC QUAD HALF BRDG TRPL SW 54SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 12
Voltage - Supply: 9 V ~ 16 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock7 488

HC08

FLASH (16 kB)

908E

512 x 8

SCI, SPI

12

9 V ~ 16 V

-40°C ~ 85°C

Surface Mount

54-BSSOP (0.295", 7.50mm Width) Exposed Pad

54-SOICW-EP

MM912G634DM1AE

NXP

IC MCU 48KB LS/HS SWITCH 48LQFP

Applications: Automotive
Core Processor: S12
Program Memory Type: FLASH (48 kB)
Controller Series: HCS12
RAM Size: 2K x 8
Interface: LIN, SCI
Number of I/O: 9
Voltage - Supply: 2.25 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

paquet: 48-LQFP Exposed Pad

Stock6 432

S12

FLASH (48 kB)

HCS12

2K x 8

LIN, SCI

9

2.25 V ~ 5.5 V

-40°C ~ 105°C

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MM908E626AVPEK

NXP

IC STEPPER MOTOR DRVR 54SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 13
Voltage - Supply: 8 V ~ 18 V
Operating Temperature: -40°C ~ 115°C
Mounting Type: Surface Mount
Package / Case: 54-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOIC

paquet: 54-SSOP (0.295", 7.50mm Width) Exposed Pad

Stock168 696

HC08

FLASH (16 kB)

908E

512 x 8

SCI, SPI

13

8 V ~ 18 V

-40°C ~ 115°C

Surface Mount

54-SSOP (0.295", 7.50mm Width) Exposed Pad

54-SOIC

MM908E625ACPEK

NXP

IC QUAD HALF-BRIDGE 54SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 13
Voltage - Supply: 8 V ~ 18 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock7 424

HC08

FLASH (16 kB)

908E

512 x 8

SCI, SPI

13

8 V ~ 18 V

-40°C ~ 85°C

Surface Mount

54-BSSOP (0.295", 7.50mm Width) Exposed Pad

54-SOICW-EP

MM908E622ACPEKR2

NXP

IC QUAD HALF BRDG TRPL SW 54SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 12
Voltage - Supply: 9 V ~ 16 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 54-SOICW-EP

paquet: 54-BSSOP (0.295", 7.50mm Width) Exposed Pad

Stock7 616

HC08

FLASH (16 kB)

908E

512 x 8

SCI, SPI

12

9 V ~ 16 V

-40°C ~ 85°C

Surface Mount

54-BSSOP (0.295", 7.50mm Width) Exposed Pad

54-SOICW-EP

MM912JS812AMAF

NXP

IC DRVR INJECTOR/IGN 100LQFP

Applications: Engine Control
Core Processor: S12XS
Program Memory Type: FLASH (128 kB)
Controller Series: HCS12
RAM Size: 8K x 8
Interface: CAN, SCI, SPI
Number of I/O: 6
Voltage - Supply: 4.7 V ~ 36 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-LQFP-EP (14x14)

paquet: 100-LQFP Exposed Pad

Stock4 688

S12XS

FLASH (128 kB)

HCS12

8K x 8

CAN, SCI, SPI

6

4.7 V ~ 36 V

-40°C ~ 125°C

Surface Mount

100-LQFP Exposed Pad

100-LQFP-EP (14x14)

MM912G634DM1AER2

NXP

IC MCU 48KB LS/HS SWITCH 48LQFP

Applications: Automotive
Core Processor: S12
Program Memory Type: FLASH (48 kB)
Controller Series: HCS12
RAM Size: 2K x 8
Interface: LIN, SCI
Number of I/O: 9
Voltage - Supply: 2.25 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP Exposed Pad
Supplier Device Package: 48-LQFP-EP (7x7)

paquet: 48-LQFP Exposed Pad

Stock6 704

S12

FLASH (48 kB)

HCS12

2K x 8

LIN, SCI

9

2.25 V ~ 5.5 V

-40°C ~ 105°C

Surface Mount

48-LQFP Exposed Pad

48-LQFP-EP (7x7)

MM912I637AM2EPR2

NXP

IC MCU LIN BATT MONITOR 48QFN

Applications: Battery Monitor
Core Processor: S12
Program Memory Type: FLASH (96 KB)
Controller Series: HCS12
RAM Size: 6K x 8
Interface: LIN, SCI, SPI
Number of I/O: 8
Voltage - Supply: 2.25 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

paquet: 48-VFQFN Exposed Pad

Stock5 984

S12

FLASH (96 KB)

HCS12

6K x 8

LIN, SCI, SPI

8

2.25 V ~ 5.5 V

-40°C ~ 125°C

Surface Mount

48-VFQFN Exposed Pad

48-QFN-EP (7x7)

MM912I637AM2EP

NXP

IC MCU LIN BATT MONITOR 48QFN

Applications: Battery Monitor
Core Processor: S12
Program Memory Type: FLASH (96 KB)
Controller Series: HCS12
RAM Size: 6K x 8
Interface: LIN, SCI, SPI
Number of I/O: 8
Voltage - Supply: 2.25 V ~ 5.5 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

paquet: 48-VFQFN Exposed Pad

Stock2 976

S12

FLASH (96 KB)

HCS12

6K x 8

LIN, SCI, SPI

8

2.25 V ~ 5.5 V

-40°C ~ 125°C

Surface Mount

48-VFQFN Exposed Pad

48-QFN-EP (7x7)

MM912G634DV2APR2

NXP

IC MCU 48KB LS/HS SWITCH 48LQFP

Applications: Automotive
Core Processor: S12
Program Memory Type: FLASH (48 kB)
Controller Series: HCS12
RAM Size: 2K x 8
Interface: LIN, SCI
Number of I/O: 9
Voltage - Supply: 2.25 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

Stock7 632

S12

FLASH (48 kB)

HCS12

2K x 8

LIN, SCI

9

2.25 V ~ 5.5 V

-40°C ~ 105°C

Surface Mount

48-LQFP

48-LQFP (7x7)

MM912KS812AMAFR2

NXP

IC MCU 16BIT HCS12 100LQFP

Applications: Engine Control
Core Processor: S12XS
Program Memory Type: FLASH (256 kB)
Controller Series: HCS12
RAM Size: 12K x 8
Interface: CAN, SCI, SPI
Number of I/O: 6
Voltage - Supply: 4.7 V ~ 36 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-LQFP-EP (14x14)

paquet: 100-LQFP Exposed Pad

Stock4 272

S12XS

FLASH (256 kB)

HCS12

12K x 8

CAN, SCI, SPI

6

4.7 V ~ 36 V

-40°C ~ 125°C

Surface Mount

100-LQFP Exposed Pad

100-LQFP-EP (14x14)

MM912G634DV2AP

NXP

IC MCU 48KB LS/HS SWITCH 48LQFP

Applications: Automotive
Core Processor: S12
Program Memory Type: FLASH (48 kB)
Controller Series: HCS12
RAM Size: 2K x 8
Interface: LIN, SCI
Number of I/O: 9
Voltage - Supply: 2.25 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

paquet: 48-LQFP

Stock143 916

S12

FLASH (48 kB)

HCS12

2K x 8

LIN, SCI

9

2.25 V ~ 5.5 V

-40°C ~ 105°C

Surface Mount

48-LQFP

48-LQFP (7x7)

MM908E624AYPEW

NXP

IC SW TRPL HISIDE MCU/LIN 54SOIC

Applications: Automotive Mirror Control
Core Processor: HC08
Program Memory Type: FLASH (16 kB)
Controller Series: 908E
RAM Size: 512 x 8
Interface: SCI, SPI
Number of I/O: 16
Voltage - Supply: 5.5 V ~ 18 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 54-BSSOP (0.295", 7.50mm Width)
Supplier Device Package: 54-SOIC

paquet: 54-BSSOP (0.295", 7.50mm Width)

Stock5 088

HC08

FLASH (16 kB)

908E

512 x 8

SCI, SPI

16

5.5 V ~ 18 V

-40°C ~ 125°C

Surface Mount

54-BSSOP (0.295", 7.50mm Width)

54-SOIC

MM912I637AV1EPR2

NXP

IC MCU LIN BATT MONITOR 48QFN

Applications: Battery Monitor
Core Processor: S12
Program Memory Type: FLASH (96 KB)
Controller Series: HCS12
RAM Size: 6K x 8
Interface: LIN, SCI, SPI
Number of I/O: 8
Voltage - Supply: 2.25 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

paquet: 48-VFQFN Exposed Pad

Stock6 160

S12

FLASH (96 KB)

HCS12

6K x 8

LIN, SCI, SPI

8

2.25 V ~ 5.5 V

-40°C ~ 105°C

Surface Mount

48-VFQFN Exposed Pad

48-QFN-EP (7x7)

MM912I637AV1EP

NXP

IC MCU LIN BATT MONITOR 48QFN

Applications: Battery Monitor
Core Processor: S12
Program Memory Type: FLASH (96 KB)
Controller Series: HCS12
RAM Size: 6K x 8
Interface: LIN, SCI, SPI
Number of I/O: 8
Voltage - Supply: 2.25 V ~ 5.5 V
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Supplier Device Package: 48-QFN-EP (7x7)

paquet: 48-VFQFN Exposed Pad

Stock7 344

S12

FLASH (96 KB)

HCS12

6K x 8

LIN, SCI, SPI

8

2.25 V ~ 5.5 V

-40°C ~ 105°C

Surface Mount

48-VFQFN Exposed Pad

48-QFN-EP (7x7)

MM912JP812AMAF

NXP

IC DRVR INJECTOR/IGN 100LQFP

Applications: Engine Control
Core Processor: S12P
Program Memory Type: FLASH (128 kB)
Controller Series: HCS12
RAM Size: 6K x 8
Interface: CAN, SCI, SPI
Number of I/O: 8
Voltage - Supply: 4.7 V ~ 36 V
Operating Temperature: -40°C ~ 125°C
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Supplier Device Package: 100-LQFP-EP (14x14)

paquet: 100-LQFP Exposed Pad

Stock6 016

S12P

FLASH (128 kB)

HCS12

6K x 8

CAN, SCI, SPI

8

4.7 V ~ 36 V

-40°C ~ 125°C

Surface Mount

100-LQFP Exposed Pad

100-LQFP-EP (14x14)