Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC DGTL SWITCH ISO-CMOS 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock4 736 |
|
- | 1 | 4.75V ~ 5.25V | 6mA | - | -40°C ~ 85°C | Surface Mount | 44-LCC (J-Lead) | 44-PLCC (16.57x16.57) |
||
Microchip Technology |
IC HDLC PROTOCOL CTLR 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock6 944 |
|
- | 1 | 4.75V ~ 5.25V | 1µA | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Microchip Technology |
IC TXRX DTMF 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock7 088 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC RECEIVER DTMF 20SSOP
|
paquet: 20-SSOP (0.209", 5.30mm Width) |
Stock7 744 |
|
- | 1 | 2.7V ~ 3.6V | 2mA | - | -40°C ~ 85°C | Surface Mount | 20-SSOP (0.209", 5.30mm Width) | 20-SSOP |
||
Microchip Technology |
IC RECEIVER DTMF 18SOIC
|
paquet: 18-SOIC (0.295", 7.50mm Width) |
Stock8 448 |
|
- | 1 | 4.75V ~ 5.25V | 3mA | - | -40°C ~ 85°C | Surface Mount | 18-SOIC (0.295", 7.50mm Width) | 18-SOIC |
||
Microchip Technology |
1CH G.FAST LINE DRIVER T&R
|
paquet: 16-QFN |
Stock5 712 |
|
- | 1 | - | - | - | - | Surface Mount | 16-QFN | 16-QFN (4x4) |
||
Microchip Technology |
1CH 100MHZ LINE DRIVER T&R
|
paquet: - |
Stock6 224 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
WSE-40 (PB FREE)
|
paquet: - |
Stock5 328 |
|
Serial | - | 1.2V | - | - | - | Surface Mount | - | 672-FCBGA (27x27) |
||
Microchip Technology |
TEMUX 336NG, PB FREE BUMP
|
paquet: - |
Stock6 960 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
TEMAP 168, LF BUMP
|
paquet: - |
Stock4 688 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
ARROW 24XFE PB FREE
|
paquet: - |
Stock4 816 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
SONET/SDH INTERFACE FOR 622 & 15
|
paquet: 196-LBGA |
Stock6 096 |
|
Serial | - | - | - | - | - | Surface Mount | 196-LBGA | 196-CABGA (15x15) |
||
Microchip Technology |
MICROPROCESSOR
|
paquet: - |
Stock6 640 |
|
JTAG, Microprocessor, Parallel, Serial | 1 | 1.2V | - | - | - | - | - | - |
||
Microchip Technology |
25PRT UNMAN L2 SW W/12 INT CU PH
|
paquet: 672-BGA |
Stock7 744 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Microchip Technology |
25PRT UNMAN L2 SW W/12 INT CU PH
|
paquet: 672-BGA |
Stock8 064 |
|
Serial | 1 | 1V | - | - | 0°C ~ 125°C | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Microchip Technology |
17PRT UNMAN L2 SW W/12 INT CU PH
|
paquet: 672-BGA |
Stock7 056 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Microchip Technology |
10PRT UNMAN L2 SW W/8 INT CU PHY
|
paquet: 672-BGA |
Stock7 500 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Microchip Technology |
17PRT UNMAN L2 SW W/12 INT CU PH
|
paquet: 672-BGA |
Stock8 172 |
|
Serial | 1 | 1V | - | - | 0°C ~ 125°C | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Microchip Technology |
10PRT UNMAN L2 SW W/8 INT CU PHY
|
paquet: 672-BGA |
Stock7 308 |
|
Serial | 1 | 1V | - | - | 0°C ~ 125°C | Surface Mount | 672-BGA | 672-HSBGA (27x27) |
||
Microchip Technology |
PB FREE MULTITRUNK SYSTEM SYNCHR
|
paquet: - |
Stock6 320 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
PB FREE T1/E1 SYSTEM SYNCHRONIZE
|
paquet: - |
Stock7 512 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
PB FREE T1/E1 SYSTEM SYNCHRONIZE
|
paquet: - |
Stock20 736 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
PB FREE MULTITRUNK SYSTEM SYNCHR
|
paquet: - |
Stock20 880 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68-QFN
|
paquet: 68-VFQFN Exposed Pad |
Stock7 356 |
|
GMII, MII, RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Microchip Technology |
4CH SLAC 3V 20 I/0 PQT44
|
paquet: - |
Stock19 932 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
4CH SLAC 3V 20 I/0 PQT44 T&R
|
paquet: - |
Stock13 308 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68QFN
|
paquet: 68-VFQFN Exposed Pad |
Stock7 176 |
|
GMII, MII, RMII | 1 | - | - | - | -40°C ~ 125°C | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Microchip Technology |
2CH VDSL CO CLASS H LD
|
paquet: 32-QFN |
Stock16 596 |
|
- | 2 | - | - | - | - | Surface Mount | 32-QFN | 32-QFN (5x5) |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 68QFN
|
paquet: 68-VFQFN Exposed Pad |
Stock13 380 |
|
RMII | 1 | - | - | - | - | Surface Mount | 68-VFQFN Exposed Pad | 68-QFN (8x8) |
||
Microchip Technology |
IC ETHERNET RGMII/RMII 48-QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock9 912 |
|
RMII | 1 | - | - | - | - | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (6x6) |