Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Protocol | Number of Drivers/Receivers | Duplex | Receiver Hysteresis | Data Rate | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC TRANSCEIVER CAN HI-SPD 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock51 876 |
|
CAN | 1/1 | Half | 200mV | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TRANSCEIVER CAN FLEX 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock14 196 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX CAN HIGH SPEED VIO 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock7 840 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX CAN HS W/SPLIT 8DFN
|
paquet: 8-VDFN Exposed Pad |
Stock9 204 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-VDFN Exposed Pad | 8-DFN (3x3) |
||
Microchip Technology |
IC TXRX CAN 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock16 908 |
|
CAN | 1/1 | Full | - | - | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC TXRX CAN HS W/SPLIT 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock18 096 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX LIN 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock18 432 |
|
LIN | 1/1 | Half | 175mV | - | 6 V ~ 27 V | -40°C ~ 125°C | Through Hole | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
CAN FD TRANSCEIVER
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock18 732 |
|
CAN | 1/1 | - | 200mV | 8Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TRANSCEIVER LIN 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock16 164 |
|
LIN | 1/1 | Half | - | 20kBaud | 5.5 V ~ 30 V | -40°C ~ 125°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX PHY 10/100 3.3V 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock5 888 |
|
MII, RMII | 1/1 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC TXRX ETHERNET 64QFN
|
paquet: 64-VFQFN Exposed Pad |
Stock17 004 |
|
Ethernet | 4/4 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (8x8) |
||
Microchip Technology |
IC TXRX ETHERNET 48QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock83 100 |
|
Ethernet | 4/4 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
IC CABLE DRIVER COAXIAL 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock6 900 |
|
- | 2/0 | - | - | - | 3 V ~ 5.5 V | - | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Microchip Technology |
IC TXRX ETHERNET 32QFN
|
paquet: 32-VFQFN Exposed Pad |
Stock3 872 |
|
MII | 1/1 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC TXRX PHY 10/100 3.3V 48SSOP
|
paquet: 48-BSSOP (0.295", 7.50mm Width) |
Stock5 168 |
|
IEEE 802.3 | 1/1 | Full | - | - | 3 V ~ 3.6 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microchip Technology |
IC TXRX ETHERNET 64QFN
|
paquet: 64-VFQFN Exposed Pad |
Stock19 068 |
|
Ethernet | 4/4 | Full | - | - | 1.8V, 2.5V, 3.3V | 0°C ~ 70°C | Surface Mount | 64-VFQFN Exposed Pad | 64-QFN (8x8) |
||
Microchip Technology |
IC TXRX LIN W/REG WDT 20QFN
|
paquet: 20-VQFN Exposed Pad |
Stock5 264 |
|
LIN | 1/1 | - | - | - | 5 V ~ 27 V | - | Surface Mount | 20-VQFN Exposed Pad | 20-QFN-EP (5x5) |
||
Microchip Technology |
IC TXRX PHY 10/100 2.5V 48SSOP
|
paquet: 48-BSSOP (0.295", 7.50mm Width) |
Stock4 624 |
|
MII, RMII | 1/1 | Full | - | - | 2.375 V ~ 2.625 V | 0°C ~ 70°C | Surface Mount | 48-BSSOP (0.295", 7.50mm Width) | 48-SSOP |
||
Microchip Technology |
IC TXRX USB FLEXPWR 25VFBGA
|
paquet: 25-VFBGA |
Stock48 048 |
|
USB 2.0 | - | - | - | - | 1.6 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 25-VFBGA | 25-VFBGA (3x3) |
||
Microchip Technology |
IC TXRX USB FLEXPWR 25VFBGA
|
paquet: 25-VFBGA |
Stock7 728 |
|
USB 2.0 | - | - | - | - | 1.6 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 25-VFBGA | 25-VFBGA (3x3) |
||
Microchip Technology |
IC TXRX CAN CTLR EXT TEMP 28QFN
|
paquet: 28-VQFN Exposed Pad |
Stock3 312 |
|
CAN | 1/1 | - | 200mV | 1Mbps | 4.5 V ~ 5.5 V | -40°C ~ 125°C | Surface Mount | 28-VQFN Exposed Pad | 28-QFN (6x6) |
||
Microchip Technology |
IC TXRX OTG USB BUS UNIV 24MLF
|
paquet: 24-VFQFN Exposed Pad, 24-MLF? |
Stock4 560 |
|
USB 2.0 | 1/1 | Half | 200mV | 400kbps | 3 V ~ 4.5 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad, 24-MLF? | 24-MLF? (4x4) |
||
Microchip Technology |
IC TXRX PHY 10/100 3.3V 32MLF
|
paquet: 32-VFQFN Exposed Pad, 32-MLF? |
Stock3 792 |
|
RMII | 1/1 | Full | - | - | 3.135 V ~ 3.465 V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad, 32-MLF? | 32-MLF? (5x5) |
||
Microchip Technology |
IC TXRX USB 2.0 FLEXPWR 25WLCSP
|
paquet: 25-WLCSP |
Stock103 212 |
|
USB 2.0 | - | Half | 150mV | - | - | -40°C ~ 85°C | Surface Mount | 25-WLCSP | 25-WLCSP |
||
Microchip Technology |
IC TXRX LIN 2.0 8SO
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock5 984 |
|
LIN | 1/1 | Half | 500mV | - | 5 V ~ 27 V | -40°C ~ 150°C | Surface Mount | 8-SOIC (0.154", 3.90mm Width) | 8-SO |
||
Microchip Technology |
IC TXRX ETHERNET 10/100 36VQFN
|
paquet: 36-VFQFN Exposed Pad |
Stock7 104 |
|
MII, RMII | - | Full | - | - | 3 V ~ 3.6 V | -40°C ~ 85°C | Surface Mount | 36-VFQFN Exposed Pad | 36-QFN (6x6) |
||
Microchip Technology |
IC TXRX USB 2.0 FLEXPWR 25BGA
|
paquet: 25-VFBGA |
Stock34 548 |
|
USB 2.0 | - | - | - | - | 1.62 V ~ 1.98 V | - | Surface Mount | 25-VFBGA | 25-BGA (3x3) |
||
Microchip Technology |
IC TXRX USB 1.8V 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock133 644 |
|
USB 2.0 | - | - | - | - | 1.62 V ~ 1.98 V | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | - |
||
Microchip Technology |
IC TXRX USB 2.0 FLEXPWR 24QFN
|
paquet: 24-TQFN Exposed Pad |
Stock118 044 |
|
USB 2.0 | - | - | - | - | 1.62 V ~ 1.98 V | -40°C ~ 85°C | Surface Mount | 24-TQFN Exposed Pad | 24-QFN (4x4) |
||
Microchip Technology |
IC USB 2.0 TXRX 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock227 160 |
|
USB 2.0 | 1/1 | - | 150mV | - | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |