Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC FLASH CONFIG 8M 8LAP
|
paquet: 8-TDFN |
Stock3 552 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 8-TDFN | 8-LAP (6x6) |
||
Microchip Technology |
IC SRL CONFG EEPROM 128K 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock3 392 |
|
128kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock6 576 |
|
2Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 056 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFG EEPROM 4M LV 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock6 832 |
|
4Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC SRL CONFIG EEPROM 512K 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 944 |
|
512kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock7 024 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock4 784 |
|
16Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER 4MBIT 3.3V 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock3 664 |
|
4Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER 100000 C-TEMP 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock6 192 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM PROG C-TEMP 3.3V 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 232 |
|
50kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER I-TEMP 512K 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock6 976 |
|
512kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER C-TEMP 512K 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock13 524 |
|
512kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM SER C-TEMP 1K 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock4 016 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SER CONFIG PROM 65K 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 296 |
|
64kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FPGA 256KB 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock3 232 |
|
256Kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SER CONFIG PROM 512K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock12 492 |
|
512kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC SERIAL CFG PROM 128K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock7 600 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SERIAL CONFIG 128K 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock15 108 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Altera |
IC CONFIG DEVICE 100QFP
|
paquet: 100-BQFP |
Stock2 640 |
|
8MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (14x20) |
||
Altera |
IC CONFIG DEVICE 1MBIT 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock31 380 |
|
1Mb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Altera |
IC CONFIG DEVICE 16MBIT 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 304 |
|
16Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Xilinx Inc. |
IC MEM PROM 16MB 3.3V 44PIN
|
paquet: 44-CCC (J-Lead) |
Stock3 776 |
|
16Mb | 3 V ~ 3.6 V | -55°C ~ 125°C (TC) | 44-CCC (J-Lead) | 44-CCCP (16.51x16.51) |
||
Xilinx Inc. |
IC CONFIG PROM 4MBIT 44TQFP
|
paquet: 44-TQFP |
Stock11 880 |
|
4Mb | 3 V ~ 3.6 V | -55°C ~ 125°C | 44-TQFP | 44-VQFP (10x10) |
||
Microchip Technology |
IC CONFIG SEEPROM 4M 3.3V 44TQFP
|
paquet: 44-TQFP |
Stock5 136 |
|
4Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-TQFP | 44-TQFP (10x10) |
||
Microchip Technology |
IC FLASH CONFIG 4M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock8 376 |
|
4Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC CONFIG SEEPROM 512K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock219 564 |
|
512kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 32MBIT 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock4 560 |
|
32Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Intel |
IC CONFIG DEVICE 1MBIT 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock4 592 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Intel |
IC CONFIG DEVICE 16MBIT 8SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock18 000 |
|
16Mb | 2.7 V ~ 3.6 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |