Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Memory Size | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx Inc. |
IC PROM SERIAL 100K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock2 048 |
|
1Mb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SERIAL 36K 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock19 920 |
|
36kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-SOIC (0.154", 3.90mm Width) | 8-TSOP |
||
Xilinx Inc. |
IC PROM SERIAL 128K 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock3 632 |
|
128kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FPGA 256K CONFIG MEM 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 864 |
|
256Kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC EEPROM FLASH 32MBIT 44-PLCC
|
paquet: 44-LCC (J-Lead) |
Stock6 336 |
|
32Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Microchip Technology |
IC FLASH CONFIG 8M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock2 848 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SRL CONFG EEPROM 512K LV 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock18 948 |
|
512kb | 3 V ~ 3.6 V, 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 1M 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 232 |
|
1Mb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 44PLCC
|
paquet: 44-LCC (J-Lead) |
Stock4 304 |
|
2Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock5 488 |
|
256Kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM SER I-TEMP 3.3V 44-VQFP
|
paquet: 44-TQFP |
Stock5 856 |
|
8Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 44-TQFP | 44-VQFP (10x10) |
||
Xilinx Inc. |
IC PROM SER 50000 C-TEMP 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock14 772 |
|
500kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Xilinx Inc. |
IC PROM PROG I-TEMP 3.3V 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock5 744 |
|
300kb | 3 V ~ 3.6 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 30000 C-TEMP 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock4 880 |
|
300kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Xilinx Inc. |
IC PROM SER 5000 C-TEMP 20-SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock5 280 |
|
150kb | 3 V ~ 3.6 V | 0°C ~ 70°C | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |
||
Microchip Technology |
IC SRL CONFIG EEPROM 64K 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock3 616 |
|
64kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC CONFIG SEEPROM 1M 3.3V 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock7 088 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SER CONFIG PROM 512K 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock2 304 |
|
512kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC SERIAL CONFIG PROM 1M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock7 872 |
|
1Mb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC SERIAL CFG PROM 256K 8-DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock11 940 |
|
256Kb | 4.75 V ~ 5.25 V | 0°C ~ 70°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Altera |
IC CONFIG DEVICE 212KBIT 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock3 952 |
|
212kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC FLASH CONFIG 16M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock5 856 |
|
16Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FLASH CONFIG 8M 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock6 720 |
|
8Mb | 2.97 V ~ 3.63 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC FPGA EEPROM 1M ALTERA 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock12 480 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Microchip Technology |
IC SRL CONFIG EEPROM 2M 20-PLCC
|
paquet: 20-LCC (J-Lead) |
Stock8 556 |
|
2Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Microchip Technology |
IC EEPROM FPGA 256KB 8-SOIC
|
paquet: 8-SOIC (0.154", 3.90mm Width) |
Stock8 964 |
|
256Kb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC |
||
Intel |
IC CONFIG DEVICE 100QFP
|
paquet: 100-BQFP |
Stock3 008 |
|
4MB | 3 V ~ 3.6 V | 0°C ~ 70°C | 100-BQFP | 100-PQFP (20x14) |
||
Intel |
IC CONFIG DEVICE 1MBIT 8DIP
|
paquet: 8-DIP (0.300", 7.62mm) |
Stock10 020 |
|
1Mb | 3 V ~ 3.6 V, 4.5 V ~ 5.5 V | -40°C ~ 85°C | 8-DIP (0.300", 7.62mm) | 8-PDIP |
||
Intel |
IC CONFIG DEVICE 65KBIT 20PLCC
|
paquet: 20-LCC (J-Lead) |
Stock6 448 |
|
65kb | 4.5 V ~ 5.5 V | -40°C ~ 85°C | 20-LCC (J-Lead) | 20-PLCC (9x9) |
||
Xilinx Inc. |
IC PROM IN SYST PRG 3.3V 20TSSOP
|
paquet: 20-TSSOP (0.173", 4.40mm Width) |
Stock6 080 |
|
1Mb | 3 V ~ 3.6 V | -40°C ~ 85°C | 20-TSSOP (0.173", 4.40mm Width) | 20-TSSOP |