Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Number of Circuits | Voltage - Supply | Current - Supply | Power (Watts) | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microsemi Corporation |
IC VOICEPORT 2CH FXS 8KHZ 80LQFP
|
paquet: 80-LQFP |
Stock3 136 |
|
PCM | 2 | - | - | - | - | Surface Mount | 80-LQFP | 80-eLQFP |
||
Microsemi Corporation |
IC LINE CARD LCAS 2CH 44TQFP
|
paquet: 44-TQFP |
Stock39 768 |
|
- | 2 | 4.75 V ~ 5.25 V | - | - | 0°C ~ 70°C | Surface Mount | 44-TQFP | 44-TQFP (10x10) |
||
Maxim Integrated |
IC LIU DS3/E3/STS-1 144CBSGA
|
paquet: 144-BGA, CSPBGA |
Stock5 792 |
|
LIU | 4 | 3.135 V ~ 3.465 V | 290mA | - | -40°C ~ 85°C | Surface Mount | 144-BGA, CSPBGA | 144-TECSBGA (13x13) |
||
Maxim Integrated |
IC LIU 3.3V DS3/E3/STS-1 28PLCC
|
paquet: 28-LCC (J-Lead) |
Stock7 520 |
|
LIU | 1 | 3.135 V ~ 3.465 V | - | - | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Silicon Labs |
IC PROSLIC FXS -135V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock2 704 |
|
GCI, PCM, SPI | 1 | 3.3V | - | - | 0°C ~ 70°C | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Exar Corporation |
IC LIU E3/DS3/STS-1 2CH 100TQFP
|
paquet: 100-LQFP |
Stock2 256 |
|
LIU | 2 | 3.135 V ~ 3.465 V | 260mA | - | -40°C ~ 85°C | Surface Mount | 100-LQFP | 100-TQFP (14x14) |
||
Intersil |
IC SLIC RINGING LP HOME 28-PLCC
|
paquet: 28-LCC (J-Lead) |
Stock4 944 |
|
- | 1 | 5V | 5mA | 305mW | -40°C ~ 85°C | Surface Mount | 28-LCC (J-Lead) | 28-PLCC (11.51x11.51) |
||
Intersil |
IC SLIC RINGING 3.3V VOB 32-QFN
|
paquet: 32-VQFN Exposed Pad |
Stock4 256 |
|
- | 1 | 3.3V | - | 305mW | 0°C ~ 75°C | Surface Mount | 32-VQFN Exposed Pad | 32-QFN (7x7) |
||
Silicon Labs |
IC SLIC/CODEC DUAL-CH 64TQFP
|
paquet: 64-TQFP |
Stock2 736 |
|
GCI, PCM, SPI | 2 | 3.3V, 5V | 65mA | 941mW | -40°C ~ 85°C | Surface Mount | 64-TQFP | 64-TQFP (10x10) |
||
IXYS Integrated Circuits Division |
IC SWITCH LINE CARD ACC 28DFN
|
paquet: 28-VDFN Exposed Pad |
Stock3 104 |
|
- | 1 | 4.5 V ~ 5.5 V | 700µA | 10.5W | -40°C ~ 110°C | Surface Mount | 28-VDFN Exposed Pad | 28-DFN |
||
IXYS Integrated Circuits Division |
IC DAA OPT SGL 56K PCMCIA 32-SOP
|
paquet: 32-SOIC (0.295", 7.50mm Width) |
Stock6 352 |
|
- | 1 | 4.75 V ~ 5.25 V | 15mA | 1W | -20°C ~ 85°C | Surface Mount | 32-SOIC (0.295", 7.50mm Width) | 32-SOIC |
||
Maxim Integrated |
IC LIU E1/T1/J1 QUAD 5V 144-BGA
|
paquet: 144-BBGA |
Stock6 032 |
|
LIU | - | 4.75 V ~ 5.25 V | 95mA | - | -40°C ~ 85°C | Surface Mount | 144-BBGA | 144-CSBGA (17x17) |
||
Microsemi Corporation |
IC TDM SWITCH 512CH 160LQFP
|
paquet: 160-LQFP |
Stock5 712 |
|
- | 1 | 3 V ~ 3.6 V | 250mA | - | -40°C ~ 85°C | Surface Mount | 160-LQFP | 160-LQFP (24x24) |
||
Microsemi Corporation |
IC CODEC/FILTER 4CH 28I/O 64LQFP
|
paquet: 64-LQFP |
Stock2 784 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 64-LQFP | 64-LQFP (14x14) |
||
IXYS Integrated Circuits Division |
IC SHDSL/ISDN DC TERM 16MLP
|
paquet: 16-VDFN Exposed Pad |
Stock7 824 |
|
ISDN, SHDSL | 1 | - | - | 1W | -40°C ~ 85°C | Surface Mount | 16-VDFN Exposed Pad | 16-MLP (7x6) |
||
Silicon Labs |
IC PROSLIC FXS ISI -110V 42QFN
|
paquet: 42-WFQFN Exposed Pad |
Stock6 768 |
|
- | - | - | - | - | - | Surface Mount | 42-WFQFN Exposed Pad | 42-QFN (5x7) |
||
Microsemi Corporation |
IC LINE DRIVER 2CH ADSL2+ 16QFN
|
paquet: 16-VFQFN Exposed Pad |
Stock210 096 |
|
- | 2 | 10 V ~ 24 V, ±5 V ~ 12 V | 4mA | - | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (4x4) |
||
Silicon Labs |
IC PROSLIC SGL FXS ANLG 48-QFN
|
paquet: 48-VFQFN Exposed Pad |
Stock5 600 |
|
- | 1 | 3.15 V ~ 3.45 V | - | - | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microsemi Solutions Sdn Bhd. |
25-PORT L2 SWITCH W/12 GE CUPHY
|
paquet: - |
Stock4 992 |
|
Serial | 1 | 1V | - | - | - | Surface Mount | - | 302-TQFP (24x24) |
||
Maxim Integrated |
IC LIU E1/T1/J1 3.3V 144-ELQFP
|
paquet: 144-LQFP Exposed Pad |
Stock6 384 |
|
LIU | 8 | 3.135 V ~ 3.465 V | 250mA | - | 0°C ~ 70°C | Surface Mount | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) |
||
Microsemi Corporation |
IC TXRX DTMF 20DIP
|
paquet: 20-DIP (0.300", 7.62mm) |
Stock112 452 |
|
- | 1 | 4.75 V ~ 5.25 V | 7mA | - | -40°C ~ 85°C | Through Hole | 20-DIP (0.300", 7.62mm) | 20-PDIP |
||
Microsemi Corporation |
FOUR CHANNEL COMBINED T1/E1/J1 T
|
paquet: 256-BGA |
Stock6 576 |
|
E1, J1, SPI, T1 | 4 | 1.8V, 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 256-BGA | 256-CABGA (17x17) |
||
Renesas Electronics America |
IC XDSL LINE DVR DUAL-PORT 24QFN
|
paquet: 24-VFQFN Exposed Pad |
Stock5 856 |
|
Serial | 2 | 10 V ~ 14.7 V | 19.5mA | - | -40°C ~ 85°C | Surface Mount | 24-VFQFN Exposed Pad | 24-QFN (4x4) |
||
Microsemi Corporation |
2CH 150V MISLIC PCM, 53QFN
|
paquet: - |
Stock5 552 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC REDRIVER PCIE 3.0 32QFN
|
paquet: 32-TFQFN Exposed Pad |
Stock8 928 |
|
- | 2 | 2.5V | - | - | - | Surface Mount | 32-TFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
paquet: - |
Stock6 768 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC INTERFACE CONTROLLER
|
paquet: - |
Stock5 472 |
|
- | - | - | - | - | - | - | - | - |
||
Microchip Technology |
IC SLIC 1CH 52DB LGBAL 32PLCC
|
paquet: 32-LCC (J-Lead) |
Stock6 592 |
|
2-Wire | 1 | 4.75V ~ 5.25V | - | - | 0°C ~ 70°C | Surface Mount | 32-LCC (J-Lead) | 32-PLCC (11.43x13.97) |
||
Microchip Technology |
IC SLAC 4CH GCI/PCM 4IO 80LQFP
|
paquet: 80-LQFP |
Stock6 016 |
|
PCM | 4 | 3.3V | - | - | -40°C ~ 85°C | Surface Mount | 80-LQFP | 80-LQFP (12x12) |
||
Microchip Technology |
IC TXRX DTMF 20SOIC
|
paquet: 20-SOIC (0.295", 7.50mm Width) |
Stock7 088 |
|
- | 1 | 4.75V ~ 5.25V | 7mA | - | -40°C ~ 85°C | Surface Mount | 20-SOIC (0.295", 7.50mm Width) | 20-SOIC |