Image |
Référence |
Fabricant |
Description |
paquet |
Stock |
Quantité |
Interface | Clock Rate | Non-Volatile Memory | On-Chip RAM | Voltage - I/O | Voltage - Core | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP |
IC DSP 1X 1GHZ SC3850 783FCBGA
|
paquet: 783-BBGA, FCBGA |
Stock6 128 |
|
Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | 1GHz | ROM (96 kB) | 576kB | 2.50V | 1.00V | -40°C ~ 105°C (TJ) | Surface Mount | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC PROCESSOR 4-CORE 783FCBGA
|
paquet: 783-BBGA, FCBGA |
Stock2 352 |
|
Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | 1GHz | ROM (96 kB) | 576kB | 2.50V | 1.00V | 0°C ~ 105°C (TJ) | Surface Mount | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
IC DSP 783FCBGA
|
paquet: 783-BBGA, FCBGA |
Stock4 304 |
|
EBI/EMI, Ethernet, I2C, PCI, Serial RapidIO, SPI, TDM, UART, UTOPIA | 800MHz | ROM (96 kB) | 10.5MB | 3.30V | 1.00V | 0°C ~ 105°C (TJ) | Surface Mount | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
NXP |
ENCRYPTION PACSUN R2.1 783FCBGA
|
paquet: 783-BBGA, FCBGA |
Stock7 904 |
|
Ethernet, I2C, SPI, TDM, UART, UTOPIA | 1GHz | External | 10.5MB | 3.30V | 1.00V | 0°C ~ 105°C (TJ) | Surface Mount | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
Texas Instruments |
IC DIG SIG PROCESSOR 143-BGA
|
paquet: 143-VFBGA |
Stock2 928 |
|
Host Interface, McBSP | 80MHz | ROM (8 kB) | 32kB | 1.8V, 2.5V, 3.3V | 1.80V | -40°C ~ 100°C (TC) | Surface Mount | 143-VFBGA | 143-BGA MicroStar Junior (7x7) |
||
Analog Devices Inc. |
IC DSP 32BIT 200MHZ EPAD 144LQFP
|
paquet: 144-LQFP Exposed Pad |
Stock5 664 |
|
DAI, SPI | 200MHz | ROM (512 kB) | 384kB | 3.30V | 1.00V | -40°C ~ 105°C (TA) | Surface Mount | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) |
||
Texas Instruments |
IC DSP ARM SOC 1517FCBGA
|
paquet: 1517-BBGA, FCBGA |
Stock3 232 |
|
EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, USB 3.0 | 1.2GHz DSP, 1.4GHz ARM? | ROM (384 kB) | 8.375MB | 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V | Variable | 0°C ~ 85°C (TC) | Surface Mount | 1517-BBGA, FCBGA | 1517-FCBGA (40x40) |
||
NXP |
IC DSP 6X 1GHZ SC3850 783FCBGA
|
paquet: 783-BBGA, FCBGA |
Stock5 360 |
|
Ethernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART | 1GHz | ROM (96 kB) | 576kB | 2.50V | 1.00V | 0°C ~ 105°C (TJ) | Surface Mount | 783-BBGA, FCBGA | 783-FCPBGA (29x29) |
||
Texas Instruments |
IC DSP FIXED-POINT 737FCBGA
|
paquet: 737-BFBGA, FCBGA |
Stock7 840 |
|
Ethernet MAC, Host Interface, I2C, Telecom, UTPOIA | 500MHz | ROM (768 kB) | 1.44MB | 1.8V, 3.3V | 1.00V | 0°C ~ 85°C (TC) | Surface Mount | 737-BFBGA, FCBGA | 737-FCBGA (24x24) |
||
ON Semiconductor |
IC DSP AUDIOLOGY AYRE 32SIP
|
paquet: - |
Stock3 504 |
|
I2C, SDA | 4.1MHz | - | - | - | - | 0°C ~ 40°C (TA) | - | - | - |
||
Analog Devices Inc. |
IC DSP CONTROLLER 32BIT 225MBGA
|
paquet: 225-BGA, CSPBGA |
Stock4 704 |
|
Host Interface, Link Port, Serial Port | 100MHz | External | 128kB | 3.30V | 1.80V | 0°C ~ 85°C (TC) | Surface Mount | 225-BGA, CSPBGA | 225-CSPBGA (17x17) |
||
Texas Instruments |
IC DGTL SIGNAL PROCESSOR 256BGA
|
paquet: 256-BGA |
Stock6 496 |
|
EBI/EMI, HPI, I2C, McASP, SPI | 350MHz | ROM (384 kB) | 288kB | 3.30V | 1.40V | 0°C ~ 90°C (TC) | Surface Mount | 256-BGA | 256-BGA (17x17) |
||
Texas Instruments |
IC DGTL MEDIA PROCESSOR 609FCBGA
|
paquet: 609-LFBGA, FCBGA |
Stock5 696 |
|
I2C, IrDA, Ethernet, McASP, PCI, SD, SPI, UART/USART, USB | 970MHz | ROM (48 kB) | 640kB | 1.35V, 1.5V, 1.8V, 3.3V | 1.1V, 1.2V, 1.35V | 0°C ~ 95°C (TJ) | Surface Mount | 609-LFBGA, FCBGA | 609-FCBGA (16x16) |
||
Texas Instruments |
TNETV1644ZDU6
|
paquet: - |
Stock4 176 |
|
HPI, I2C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC | 600MHz | ROM (64 kB) | 240kB | 1.8V, 3.3V | 1.05V, 1.20V | 0°C ~ 90°C (TJ) | - | - | - |
||
Texas Instruments |
DAVINCI DIGITAL MEDIA SYSTEM-ON-
|
paquet: - |
Stock7 792 |
|
HPI, I2C, McASP, McBSP, PCI, UART, 10/100 Ethernet MAC | 500MHz | ROM (64 kB) | 240kB | 1.8V, 3.3V | 1.05V, 1.20V | -40°C ~ 125°C (TJ) | - | - | - |
||
ON Semiconductor |
IC DSP AUDIOLOGY 25SIP
|
paquet: - |
Stock4 720 |
|
I2C, SDA | 375MHz | - | - | - | - | 0°C ~ 40°C (TA) | - | - | - |
||
Cirrus Logic Inc. |
IC DSP DECODER 32BIT 128-LQFP
|
paquet: 128-LQFP |
Stock7 328 |
|
DAI/O, EBI/EMI, I2C, Parallel, SPI | 150MHz | ROM (128 kB) | 82kB | 3.30V | 1.80V | 0°C ~ 70°C (TA) | Surface Mount | 128-LQFP | 128-LQFP (20x14) |
||
Texas Instruments |
IC DSP FIXED PT 120 MIPS 144-BGA
|
paquet: 144-LFBGA |
Stock3 552 |
|
Host Interface, McBSP | 120MHz | ROM (32 kB) | 64kB | 3.30V | 1.50V | -40°C ~ 100°C (TC) | Surface Mount | 144-LFBGA | 144-BGA MICROSTAR (12x12) |
||
Texas Instruments |
IC CMOS DSP 100LQFP
|
paquet: 100-LQFP |
Stock21 360 |
|
SSP, UART | 40MHz | - | 1kB | 3.30V | 3.30V | -40°C ~ 85°C (TA) | Surface Mount | 100-LQFP | 100-LQFP (14x14) |
||
Analog Devices Inc. |
IC DSP SHARC 266MHZ LP 196CSBGA
|
paquet: 196-LFBGA, CSPBGA |
Stock6 720 |
|
DAI, DPI, EBI/EMI, I2C, SPI, SPORT, UART/USART | 266MHz | ROM (4 Mbit) | 5Mbit | 3.30V | 1.20V | -40°C ~ 85°C (TA) | Surface Mount | 196-LFBGA, CSPBGA | 196-CSPBGA (12x12) |
||
Analog Devices Inc. |
IC CCD SIGNAL PROCESSOR 176LQFP
|
paquet: 176-LQFP Exposed Pad |
Stock23 124 |
|
EBI/EMI, DAI, I2C, SPI, SPORT, UART/USART | 400MHz | External | 5Mbit | 3.30V | 1.10V | 0°C ~ 70°C (TA) | Surface Mount | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) |
||
Analog Devices Inc. |
IC DSP 32BIT 400MHZ 208-LQFP
|
paquet: 208-LQFP Exposed Pad |
Stock6 480 |
|
DAI, DPI | 400MHz | ROM (768 kB) | 256kB | 3.30V | 1.20V | 0°C ~ 70°C (TA) | Surface Mount | 208-LQFP Exposed Pad | 208-LQFP-EP (28x28) |
||
Texas Instruments |
IC FIXED-POINT DSP 288-BGA
|
paquet: 288-LFBGA |
Stock5 840 |
|
McBSP, PCI | 200MHz | External | 128kB | 3.30V | 1.50V | 0°C ~ 90°C (TC) | Surface Mount | 288-LFBGA | 288-BGA Microstar (16x16) |
||
Texas Instruments |
IC DSP FIXED-POINT 376-BGA
|
paquet: 376-BBGA Exposed Pad |
Stock19 620 |
|
HPI, I2C, McASP, McBSP, UART, 10/100 Ethernet MAC | 700MHz | ROM (64 kB) | 96kB | 1.8V, 3.3V | 1.05V, 1.20V | 0°C ~ 90°C (TJ) | Surface Mount | 376-BBGA Exposed Pad | 376-BGA (23x23) |
||
Texas Instruments |
IC DIGITAL MEDIA SOC 338NFBGA
|
paquet: 338-LFBGA |
Stock17 004 |
|
EBI/EMI, Ethernet, I2C, McBSP, SPI, UART, USB | 300MHz | ROM (16 kB) | 56kB | 1.8V, 3.3V | 1.35V | 0°C ~ 85°C (TC) | Surface Mount | 338-LFBGA | 338-NFBGA (13x13) |
||
Texas Instruments |
IC DSP FIX/FLOAT POINT 176HLQFP
|
paquet: 176-LQFP Exposed Pad |
Stock7 408 |
|
EBI/EMI, Ethernet MAC, I2C, McASP, SPI, UART, USB | 456MHz | External | 320kB | 3.30V | 1.20V | -40°C ~ 90°C (TJ) | Surface Mount | 176-LQFP Exposed Pad | 176-HLQFP (24x24) |
||
Texas Instruments |
IC DSP FIXED-POINT 144BGA
|
paquet: 144-LFBGA |
Stock4 016 |
|
I2C, I2S, MMC/SD, SPI, UART | 100MHz | ROM (128 kB) | 64kB | 1.8V, 2.5V, 2.75V, 3.3V | 1.05V, 1.30V | -10°C ~ 70°C (TC) | Surface Mount | 144-LFBGA | 144-BGA MICROSTAR (12x12) |
||
Texas Instruments |
IC FLOATING POINT DSP 272-BGA
|
paquet: 272-BBGA |
Stock7 692 |
|
Host Interface, McBSP | 250MHz | External | 72kB | 3.30V | 1.26V | 0°C ~ 90°C (TC) | Surface Mount | 272-BBGA | 272-BGA (27x27) |
||
AKM Semiconductor Inc. |
IC DSP CODEC 24BIT 36QFN
|
paquet: 36-VFQFN Exposed Pad |
Stock12 144 |
|
I2C, SPI | 18.6MHz | - | 54kB | 3.30V | 1.20V | -40°C ~ 85°C (TA) | Surface Mount | 36-VFQFN Exposed Pad | 36-QFN (6x6) |
||
Analog Devices Inc. |
32BIT SIGMADSP AUDIO 16K/48K
|
paquet: 72-VFQFN Exposed Pad, CSP |
Stock7 408 |
|
I²C, SPI | 147.456MHz | ROM (64 kB) | 192kB | 3.30V | 1.20V | -40°C ~ 105°C (TA) | Surface Mount | 72-VFQFN Exposed Pad, CSP | 72-LFCSP (10x10) |