Produits Amphenol FCI - Supports pour CI, transistors

SIP1X04-011BLF

Amphenol FCI

CONN SOCKET SIP 4POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

paquet: -

Stock7 668

4 (1 x 4)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

SIP1X09-001BLF

Amphenol FCI

CONN SOCKET SIP 9POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

paquet: -

Stock3 816

9 (1 x 9)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

SIP1X06-001BLF

Amphenol FCI

CONN SOCKET SIP 6POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

paquet: -

Stock5 238

6 (1 x 6)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

SIP1X08-001BLF

Amphenol FCI

CONN SOCKET SIP 8POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

paquet: -

Stock4 824

8 (1 x 8)

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

SIP1X05-011BLF

Amphenol FCI

CONN SOCKET SIP 5POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

paquet: -

Stock4 284

5 (1 x 5)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

SIP1X07-011BLF

Amphenol FCI

CONN SOCKET SIP 7POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

paquet: -

Stock2 034

7 (1 x 7)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

SIP1X06-011BLF

Amphenol FCI

CONN SOCKET SIP 6POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

paquet: -

Stock5 274

6 (1 x 6)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

SIP1X07-014BLF

Amphenol FCI

CONN SOCKET SIP 7POS TIN

Type: SIP
Number of Positions or Pins (Grid): 7 (1 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150µin (3.81µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

paquet: -

Stock7 650

7 (1 x 7)

0.100" (2.54mm)

Tin

150µin (3.81µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

SIP1X08-011BLF

Amphenol FCI

CONN SOCKET SIP 8POS GOLD

Type: SIP
Number of Positions or Pins (Grid): 8 (1 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

paquet: -

Stock8 496

8 (1 x 8)

0.100" (2.54mm)

Gold

10µin (0.25µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

SIP1X05-014BLF

Amphenol FCI

CONN SOCKET SIP 5POS TIN

Type: SIP
Number of Positions or Pins (Grid): 5 (1 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150µin (3.81µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

paquet: -

Stock6 714

5 (1 x 5)

0.100" (2.54mm)

Tin

150µin (3.81µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

SIP1X06-014BLF

Amphenol FCI

CONN SOCKET SIP 6POS TIN

Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150µin (3.81µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

paquet: -

Stock6 498

6 (1 x 6)

0.100" (2.54mm)

Tin

150µin (3.81µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Brass

Polyphenylene Sulfide (PPS), Glass Filled

-

69802-444LF

Amphenol FCI

CONN SOCKET

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

paquet: -

Stock2 322

-

69802-432LF

Amphenol FCI

CONN SOCKET PLCC 32POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -55°C ~ 125°C

paquet: -

Stock2 682

32 (2 x 7, 2 x 9)

0.050" (1.27mm)

Tin

150µin (3.81µm)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

150µin (3.81µm)

Phosphor Bronze

Polyphenylene Sulfide (PPS)

-55°C ~ 125°C

69802-032LF

Amphenol FCI

CONN SOCKET PLCC 32POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -55°C ~ 125°C

paquet: -

Stock5 238

32 (2 x 7, 2 x 9)

0.050" (1.27mm)

Tin

150µin (3.81µm)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

150µin (3.81µm)

Phosphor Bronze

Polyphenylene Sulfide (PPS)

-55°C ~ 125°C

DILB42P-223TLF

Amphenol FCI

CONN IC DIP SOCKET

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

paquet: -

Stock7 200

-

DILB32P-223TLF

Amphenol FCI

CONN IC DIP SOCKET

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

paquet: -

Stock2 592

-

DILB24P-223TLF

Amphenol FCI

CONN IC DIP SOCKET

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

paquet: -

Stock7 272

-

DILB24P-224TLF

Amphenol FCI

CONN IC DIP SOCKET

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

paquet: -

Stock4 032

-

DILB18P-223TLF

Amphenol FCI

CONN IC DIP SOCKET

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

paquet: -

Stock3 024

-

69802-144LF

Amphenol FCI

CONN SOCKET PLCC 44POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 44 (4 x 11)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -55°C ~ 125°C

paquet: -

Stock16 392

44 (4 x 11)

0.050" (1.27mm)

Tin

150µin (3.81µm)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

150µin (3.81µm)

Phosphor Bronze

Polyphenylene Sulfide (PPS)

-55°C ~ 125°C

69802-044LF

Amphenol FCI

CONN SOCKET PLCC 44POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 44 (4 x 11)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -55°C ~ 125°C

paquet: -

Stock36 744

44 (4 x 11)

0.050" (1.27mm)

Tin

150µin (3.81µm)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

150µin (3.81µm)

Phosphor Bronze

Polyphenylene Sulfide (PPS)

-55°C ~ 125°C

54020-32030LF

Amphenol FCI

CONN SOCKET PLCC 32POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100µin (2.54µm)
Contact Material - Post: Copper Alloy
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock27 942

32 (2 x 7, 2 x 9)

0.050" (1.27mm)

Tin

100µin (2.54µm)

Copper Alloy

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Tin

100µin (2.54µm)

Copper Alloy

Polyphenylene Sulfide (PPS)

-40°C ~ 105°C

69802-132LF

Amphenol FCI

CONN SOCKET PLCC 32POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 32 (2 x 7, 2 x 9)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 150µin (3.81µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Surface Mount
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 150µin (3.81µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -55°C ~ 125°C

paquet: -

Stock88 020

32 (2 x 7, 2 x 9)

0.050" (1.27mm)

Tin

150µin (3.81µm)

Phosphor Bronze

Surface Mount

Closed Frame

Solder

0.050" (1.27mm)

Tin

150µin (3.81µm)

Phosphor Bronze

Polyphenylene Sulfide (PPS)

-55°C ~ 125°C

DILB40P-223TLF

Amphenol FCI

CONN IC DIP SOCKET 40POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 40 (2 x 20)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100µin (2.54µm)
Contact Material - Post: Copper Alloy
Housing Material: Polyamide (PA), Nylon
Operating Temperature: -55°C ~ 105°C

paquet: -

Stock41 388

40 (2 x 20)

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Polyamide (PA), Nylon

-55°C ~ 105°C

DILB28P-223TLF

Amphenol FCI

CONN IC DIP SOCKET 28POS TIN

Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 28 (2 x 14)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100µin (2.54µm)
Contact Material - Post: Copper Alloy
Housing Material: Polyamide (PA), Nylon
Operating Temperature: -55°C ~ 105°C

paquet: -

Stock96 786

28 (2 x 14)

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Polyamide (PA), Nylon

-55°C ~ 105°C

DILB20P-223TLF

Amphenol FCI

CONN IC DIP SOCKET 20POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 20 (2 x 10)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100µin (2.54µm)
Contact Material - Post: Copper Alloy
Housing Material: Polyamide (PA), Nylon
Operating Temperature: -55°C ~ 105°C

paquet: -

Stock56 160

20 (2 x 10)

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Polyamide (PA), Nylon

-55°C ~ 105°C

DILB16P-223TLF

Amphenol FCI

CONN IC DIP SOCKET 16POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 16 (2 x 8)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100µin (2.54µm)
Contact Material - Post: Copper Alloy
Housing Material: Polyamide (PA), Nylon
Operating Temperature: -55°C ~ 105°C

paquet: -

Stock116 790

16 (2 x 8)

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Polyamide (PA), Nylon

-55°C ~ 105°C

DILB14P-223TLF

Amphenol FCI

CONN IC DIP SOCKET 14POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 14 (2 x 7)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100µin (2.54µm)
Contact Material - Post: Copper Alloy
Housing Material: Polyamide (PA), Nylon
Operating Temperature: -55°C ~ 105°C

paquet: -

Stock104 868

14 (2 x 7)

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Polyamide (PA), Nylon

-55°C ~ 105°C

DILB8P-223TLF

Amphenol FCI

CONN IC DIP SOCKET 8POS TIN

Type: DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 8 (2 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100µin (2.54µm)
Contact Material - Post: Copper Alloy
Housing Material: Polyamide (PA), Nylon
Operating Temperature: -55°C ~ 105°C

paquet: -

Stock233 664

8 (2 x 4)

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Through Hole

Open Frame

Solder

0.100" (2.54mm)

Tin

100µin (2.54µm)

Copper Alloy

Polyamide (PA), Nylon

-55°C ~ 105°C

54020-44030LF

Amphenol FCI

CONN SOCKET PLCC 44POS TIN

Type: PLCC
Number of Positions or Pins (Grid): 44 (4 x 11)
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100µin (2.54µm)
Contact Material - Mating: Copper Alloy
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100µin (2.54µm)
Contact Material - Post: Copper Alloy
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -40°C ~ 105°C

paquet: -

Stock45 306

44 (4 x 11)

0.050" (1.27mm)

Tin

100µin (2.54µm)

Copper Alloy

Through Hole

Closed Frame

Solder

0.050" (1.27mm)

Tin

100µin (2.54µm)

Copper Alloy

Polyphenylene Sulfide (PPS)

-40°C ~ 105°C